2-ethyl-1-hexylammonium bicarbonate | 904927-95-3

• 分子结构分类: 有机化合物 - 有机氮化合物
• 英文名称: 2-ethyl-1-hexylammonium bicarbonate
• 英文别名: 2-Ethylhexylazanium;hydrogen carbonate；2-ethylhexylazanium;hydrogen carbonate
• CAS: 904927-95-3
• 化学式: CH₂O₃*C₈H₁₉N
• 分子量: 191.271
• InChiKey: LFTWYPLGYKQPMV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.33
• 重原子数：
  13
• 可旋转键数：
  5
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.89
• 拓扑面积：
  88
• 氢给体数：
  2
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  2-ethyl-1-hexylammonium bicarbonate 、 copper(II) formate 反应 0.5h， 生成 Cu(HCOO)₂(2-ethyl-1-hexylammonium bicarbonate)₂
  参考文献：
  名称：

  Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

  摘要：

  将甲酸铜（II）和 2-乙基-1-己基碳酸氢铵（EHABC）混合制备了铜墨水，以克服纳米铜墨水的聚集和降解等弱点。将油墨涂覆在玻璃基板上，在$110^{\circ}C$至$150^{\circ}C$两种不同的气氛（如氮气和甲酸与甲醇的混合气体）下煅烧生成导电铜膜。在$150^{\circ}C$气态甲酸条件下，铜膜的电阻率最低，为$1.88{\mu}{\Omega}{\cdot}cm$。一个月后，长期电阻率从$1.88{\mu}{\mega}{\cdot}cm$上升到$2.61{\mu}{\mega}{\cdot}cm$。

  DOI：

  10.5012/bkcs.2014.35.1.147
• 作为产物：
  描述：

  2-乙基己胺 、 二氧化碳 在 水 作用下， 生成 2-ethyl-1-hexylammonium bicarbonate
  参考文献：
  名称：

  Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

  摘要：

  将甲酸铜（II）和 2-乙基-1-己基碳酸氢铵（EHABC）混合制备了铜墨水，以克服纳米铜墨水的聚集和降解等弱点。将油墨涂覆在玻璃基板上，在$110^{\circ}C$至$150^{\circ}C$两种不同的气氛（如氮气和甲酸与甲醇的混合气体）下煅烧生成导电铜膜。在$150^{\circ}C$气态甲酸条件下，铜膜的电阻率最低，为$1.88{\mu}{\Omega}{\cdot}cm$。一个月后，长期电阻率从$1.88{\mu}{\mega}{\cdot}cm$上升到$2.61{\mu}{\mega}{\cdot}cm$。

  DOI：

  10.5012/bkcs.2014.35.1.147

文献信息

• Ink Composition for Optoelectronic Device
  申请人：Chung Kwang Choon

  公开号：US20110024668A1

  公开（公告）日：2011-02-03

  The present invention relates to an ink composition for printing capable of inking materials for an optoelectronic device and directly applying the inked materials to a patterning process. More particularly, the present invention relates to a printing ink composition for manufacturing an optoelectronic device capable of direct patterning by adjusting the physical property of a core material so as to be suitable for a printing method in the manufacturing of optoelectronic devices, for example, an organic electroluminescent device or an organic thin film transistor.

  本发明涉及一种适用于打印的油墨组合物，能够为光电器件的材料进行上墨，并将上墨材料直接应用于图案化工艺。更具体地说，本发明涉及一种打印油墨组合物，用于制造一种光电器件，通过调整核心材料的物理特性，使其适合于光电器件制造中的打印方法，例如有机电致发光器件或有机薄膜晶体管的直接图案化。
• Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same
  申请人：Inktec Co., Ltd.

  公开号：EP2752470A1

  公开（公告）日：2014-07-09

  The present invention relates to a process for preparation of silver complex compound and the compositions of silver ink containing the same. The present invention includes a) preparing silver complex compound with special structure by reacting silver compound with at least one or two mixtures selected from ammonium carbamate compound, ammonium carbonate compound or ammonium bicarbonate compound and b) preparing silver nanoparticles by reacting the silver complex compound with reducer or reducing or pyrolyzing the silver complex compound by applying heat thereto. The preparing method according to the present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver complex compound, fire the silver complex compound even when it is fired at a low temperature of 150 °C or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity while facilitating the thickness control of the coating, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.

  本发明涉及一种制备银络合物和含有银络合物的银墨组合物的工艺。 本发明包括 a) 通过银化合物与至少一种或两种选自氨基甲酸铵化合物、碳酸铵化合物或碳酸氢铵化合物的混合物反应，制备具有特殊结构的银络合物；b) 通过银络合物与还原剂反应，或通过加热还原或热解银络合物，制备银纳米粒子。 根据本发明的制备方法，可以通过简单的制备工艺制备出各种形状的银纳米粒子，提高了银络合物尺寸的选择性，即使在 150 ℃ 或更低的低温下短时间内烧制银络合物，也能使油墨组合物形成涂层或显示高导电性的精细图案，同时便于控制涂层的厚度，并使油墨组合物能够应用于反射膜材料、电磁波屏蔽和抗菌剂等。
• PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL AND SURFACE-MODIFIED REINFORCING FIBERS
  申请人：Teijin Limited

  公开号：EP3444089A1

  公开（公告）日：2019-02-20

  The present invention provides a prepreg which is composed of at least a matrix resin and reinforcing fibers, and which is characterized in that: conductive parts are formed on one surface or both surfaces of a fiber layer that is formed of the reinforcing fibers; and the volume resistivity ρ (Ωcm) of the fiber layer in the thickness direction, the thickness t (cm) of the fiber layer and the average interval L (cm) between the conductive parts arranged on the prepreg surface satisfy formula (1). t/ρ×1/L×100≥0.5

  本发明提供了一种至少由基体树脂和增强纤维组成的预浸料，其特征在于：在由增强纤维形成的纤维层的一个表面或两个表面上形成导电部件；纤维层在厚度方向上的体积电阻率ρ（Ωcm）、纤维层的厚度t（cm）和布置在预浸料表面上的导电部件之间的平均间隔L（cm）满足式（1）。 t/ρ×1/L×100≥0.5
• Prepreg, fiber-reinforced composite material and surface-modified reinforcing fibers
  申请人：TEIJIN LIMITED

  公开号：US11352472B2

  公开（公告）日：2022-06-07

  The present invention provides a prepreg which is composed of at least a matrix resin and reinforcing fibers, and which is characterized in that: conductive parts are formed on one surface or both surfaces of a fiber layer that is formed of the reinforcing fibers; and the volume resistivity ρ (Ωcm) of the fiber layer in the thickness direction, the thickness t (cm) of the fiber layer and the average interval L (cm) between the conductive parts arranged on the prepreg surface satisfy formula (1). t/ρ×1/L×100≥0.5  Formula (1):

  本发明提供了一种预浸料，它至少由基体树脂和增强纤维组成，其特征在于：在由增强纤维形成的纤维层的一个表面或两个表面上形成导电部件；纤维层在厚度方向上的体积电阻率ρ（Ωcm）、纤维层的厚度t（cm）和布置在预浸料表面上的导电部件之间的平均间隔L（cm）满足式（1）。 t/ρ×1/L×100≥0.5 公式 (1)：
• CONDUCTIVE INKS AND MANUFACTURING METHOD THEREOF
  申请人：Inktec Co., Ltd.

  公开号：EP1853671A1

  公开（公告）日：2007-11-14