2,2',6,6'-Tetrabromodiphenyl ether | 446254-26-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2',6,6'-Tetrabromodiphenyl ether
• 英文别名: 1,3-dibromo-2-(2,6-dibromophenoxy)benzene
• CAS: 446254-26-8
• 化学式: C₁₂H₆Br₄O
• 分子量: 485.79
• InChiKey: WCDCHQGVTZHVSO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.2
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• Polyethylene ether thermoplastic protected from discoloration during processing
  申请人：BORG-WARNER CHEMICALS, INC.

  公开号：EP0267363A1

  公开（公告）日：1988-05-18

  A thermoplastic composition is provided which comprises a polyphenylene ether such as the copolymer of 2,6-dimethylphenol with 2,3,6-trimethylphenol, with an effective amount of an alpha-hydroxyketone such as benzoin to prevent discoloration on thermal processing.

  提供了一种热塑性塑料组合物，它包括聚苯醚（如 2，6-二甲基苯酚与 2，3，6-三甲基苯酚的共聚物）和有效量的α-羟基酮（如安息香），以防止热加工时褪色。
• Poly(arylene ether) adhesive compositions
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1167484A2

  公开（公告）日：2002-01-02

  An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

  一种用于热塑性薄膜的粘合剂是由聚芳基醚、热固性树脂、增韧剂、可选增塑剂和固化剂的混合物组成。这种粘合剂在电路板应用中特别有用。
• Poly(Phenylene ether) - Polyvinyl thermosetting resin
  申请人：General Electric Company

  公开号：EP1834975A1

  公开（公告）日：2007-09-19

  A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.

  一种封端聚（亚苯基醚）树脂组合物是由（1）聚（亚苯基醚）化合物（PPE）和（2）可固化的不饱和单体组合物组成，其中至少有一部分，最好是全部羟基与含有乙烯基不饱和（碳-碳双键）的化合物反应，该化合物与不饱和单体进一步反应（反应封端 PPE）。该组合物可选择含有聚合催化剂、阻燃化合物和纤维增强剂。该组合物经固化后可形成层压板，并包覆铜以形成电路板。
• Poly(phenylene ether) - polyvinyl thermosetting resin
  申请人：SABIC Innovative Plastics IP B.V.

  公开号：EP2316870A1

  公开（公告）日：2011-05-04

  The invention relates to a curable poly(phenylene ether) composition comprising a poly(phenylene ether) containing hydroxyl groups wherein at least 10% of the hydroxyl groups have been capped with a compound containing ethylenic unsaturation; a curable unsaturated monomer composition; and a curing catalyst. The invention also relates to a laminate comprising said curable composition.

  本发明涉及一种可固化的聚（亚苯基醚）组合物，该组合物包含含有羟基的聚（亚苯基醚），其中至少有 10%的羟基被含有乙烯不饱和的化合物封端；一种可固化的不饱和单体组合物；以及一种固化催化剂。本发明还涉及一种包含上述可固化组合物的层压板。
• Curable resin composition, method for the preparation thereof, and articles derived therefrom
  申请人：——

  公开号：US20020016420A1

  公开（公告）日：2002-02-07

  A curable resin composition includes an unsaturated polyester, an alkenyl aromatic compound, and a capped poly(arylene ether). The composition is suitable for low temperature curing and exhibits reduced curing shrinkage and reduced brittleness.

  一种可固化树脂组合物包括不饱和聚酯、烯芳基化合物和封端聚芳基醚。该组合物适用于低温固化，并能降低固化收缩率和脆性。