4-Amino-N-(4-aminophenyl)-2-methoxybenzamide | 117846-34-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-Amino-N-(4-aminophenyl)-2-methoxybenzamide
• CAS: 117846-34-1
• 化学式: C₁₄H₁₅N₃O₂
• 分子量: 257.29
• InChiKey: BSOIJOQMWWJBSL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  19
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.07
• 拓扑面积：
  90.4
• 氢给体数：
  3
• 氢受体数：
  4

文献信息

• FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION
  申请人：NIPPON STEEL CHEMICAL CO., LTD.

  公开号：EP0297139A1

  公开（公告）日：1989-01-04

  The flexible print board contains as an insulating material a less heat-swelling resin having structural units represented by general formula (I), wherein Ar1 represents a tetravalent aromatic group, and Ar2 represents a compound of formula (II), (III) or (IV). wherein R1 to R8 may be the same or different and each represents a lower alkyl group, a lower alkoxy group or a halogen atom, and n1 to n8 each represents an integer of 0 to 4. This flexible board is produced by directly applying a solution of polyamidoimide precursor on a conductive substance and conducting imidation to form the insulating material of the less heat-swelling resin of the above- described general formula (I). The flexible printed circuit board undergoes less curling and has excellent adhesiveness, bending resistance, and dimensional stability.

  柔性印制板含有一种热膨胀性较低的树脂作为绝缘材料，该树脂具有通式（I）所代表的结构单元，其中 Ar1 代表四价芳香族基团，Ar2 代表式（II）、（III）或（IV）化合物。 这种柔性电路板是通过在导电物质上直接涂敷聚酰胺酰亚胺前体溶液并进行酰亚胺化，形成上述通式（I）的热膨胀性较小的树脂绝缘材料而制成的。这种柔性印刷电路板的卷曲现象较少，并且具有出色的粘合性、抗弯曲性和尺寸稳定性。
• Polyimide composite coverlays and methods and compositions relating thereto
  申请人：Dueber E. Thomas

  公开号：US20060210819A1

  公开（公告）日：2006-09-21

  The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.

  本发明涉及由双层聚酰胺酸基复合材料衍生的覆盖层组合物，该组合物具有覆盖层和与之相邻的粘合剂层，其中覆盖层包括聚酰胺酸和其他添加剂，使组合物具有光敏性和水基显影性，粘合剂层可形成玻璃化转变温度在170-250℃之间的聚酰亚胺。这些双层组合物特别有用，因为它们具有介于 10 至 40 ppm/° C 之间的整体平面内 CTE，当用作基于聚酰亚胺的覆盖层材料时，该范围有助于避免柔性印刷电路不必要的卷曲。
• Polyimide film, polyimide metal laminate and process for producing the same
  申请人：Kawaguchi Masao

  公开号：US20080299402A1

  公开（公告）日：2008-12-04

  The present invention relates to a polyimide-metal laminate that ensures a high adhesion of a metal layer and suitable for use as a material of a high density circuit board. In particular, it provides a polyimide film characterized by having undergone a surface treatment with an alkaline aqueous solution containing a permanganate. The alkaline aqueous solution preferably contains a hydroxide. It also provides a polyimide-metal laminate characterized in that on a surface of the polyimide film a thermoplastic polyimide layer and a metal layer are formed, and a method of producing the polyimide-metal laminate.
• US4847353A
  申请人：——

  公开号：US4847353A

  公开（公告）日：1989-07-11
• US4939039A
  申请人：——

  公开号：US4939039A

  公开（公告）日：1990-07-03