To provide a process for producing an anthranilamide having the 3-position of pyrazole substituted by a bromine atom, or its salt.
A process for producing an anthranilamide compound represented by the formula (I) or its salt:
which comprises reacting a compound represented by the formula (II):
(wherein Z is 2-pyridyl, 3-pyridyl, 4-pyridyl or benzene substituted by a nitro group), with a brominating agent, to produce a compound represented by the formula (III):
and further reacting the compound of the formula (III) with an oxidizing agent.
POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3896521A1
公开(公告)日:2021-10-20
Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2):
wherein T1 and T2 may be the same as, or different from, each other and represent any of -CO- and -SO2-; X1 is a tetravalent organic group; and 1 is 0 or 1; and X2 is a divalent organic group.
Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component
申请人:International Business Machines Corporation
公开号:US11333975B2
公开(公告)日:2022-05-17
Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2):
wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.