Abrasive-free chemical mechanical polishing composition and polishing process containing same
申请人:——
公开号:US20040134873A1
公开(公告)日:2004-07-15
The present invention relates generally to a chemical mechanical polishing composition for polishing a metal, a metal oxide, and/or a metal nitride layer of a substrate, which composition is substantially free of abrasive particles and comprises: a hydroxylamine derivative; a corrosion inhibitor; and water, wherein water comprises the majority of the composition. The composition may optionally include, or alternately be substantially free from, one or more of the following: hydroxylamine, acid and/or base to adjust pH, two carbon atom linkage alkanolamine compounds, quaternary ammonium salts, chelating agents, organic solvents, non-hydroxyl-containing amine compounds, surfactants, additional oxidizing agents, and non-abrasive additives. A process for chemically mechanically polishing a substrate using such a polishing composition is also provided herein.
本发明一般涉及一种化学机械抛光组合物,用于抛光基底的金属、金属氧化物和/或金属氮化物层,该组合物基本上不含研磨颗粒,包括:羟胺衍生物;腐蚀抑制剂;水,其中水占组合物的大部分。该组合物可选择性地包括或基本上不包括以下一种或多种:羟胺、调节 pH 值的酸和/或碱、两个碳原子连接的烷醇胺化合物、季铵盐、螯合剂、有机溶剂、非含羟胺化合物、表面活性剂、附加氧化剂和非研磨添加剂。本文还提供了一种使用这种抛光组合物对基底进行化学机械抛光的工艺。