NOVEL ARYL ESTER COMPOUND, ITS PRODUCTION PROCESS , EPOXY RESIN COMPOSITION USING SAID COMPOUND, AND COPPER-CLAD LAMINATE USING THE EPOXY RESIN COMPOSITION
申请人:——
公开号:US20020010288A1
公开(公告)日:2002-01-24
An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula:
1
with a carbonyl compound represented by the general formula:
2
which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.
一种芳基酯化合物,由多水酚组成,其中至少有一个羟基与具有 1 至 20 个碳原子的有机酸或其衍生物酯化,所述多水酚是通式所代表的酚类化合物的缩合产物:
1
的羰基化合物的缩合产物:
2
该芳基酯化合物用作环氧树脂的固化剂时,可得到具有低介电常数和低介电损耗正切的固化产品;环氧树脂组合物,其主要成分包括环氧树脂、上述芳基酯化合物和固化促进剂;以及使用该环氧树脂组合物的覆铜板。与传统层压板相比,覆铜层压板具有低介电常数和低介电损耗正切,粘合性极佳,因此适用于高速运行的多层印刷线路板,特别是在高频区域。