N~1~,N~3~-Bis(5-amino-2-hydroxyphenyl)benzene-1,3-dicarboxamide | 25596-69-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N~1~,N~3~-Bis(5-amino-2-hydroxyphenyl)benzene-1,3-dicarboxamide
• 英文别名: 1-N,3-N-bis(5-amino-2-hydroxyphenyl)benzene-1,3-dicarboxamide
• CAS: 25596-69-4
• 化学式: C₂₀H₁₈N₄O₄
• 分子量: 378.4
• InChiKey: FEXJXYLOJRNMID-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  28
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  151
• 氢给体数：
  6
• 氢受体数：
  6

文献信息

• RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
  申请人：Toray Industries, Inc.

  公开号：EP3225647A1

  公开（公告）日：2017-10-04

  Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).

  本发明提供了一种能够生产具有高灵敏度和耐热性的光敏树脂组合物的树脂。公开了一种以通式（1）或（2）表示的结构为主要成分的树脂，其中 R2 具有通式（3）表示的有机基团和通式（4）表示的有机基团。
• Resin and photosensitive resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10197915B2

  公开（公告）日：2019-02-05

  Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).

  本发明提供了一种能够生产具有高灵敏度和耐热性的光敏树脂组合物的树脂。公开了一种以通式（1）或（2）表示的结构为主要成分的树脂，其中 R2 具有通式（3）表示的有机基团和通式（4）表示的有机基团。
• Resin, composition, cured film, method for manufacturing cured film and semiconductor device
  申请人：FUJIFILM Corporation

  公开号：US10450417B2

  公开（公告）日：2019-10-22

  Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.

  本发明提供了一种能够生成翘曲较少且均匀性良好的固化膜以及生成浮渣较少的固化膜（图案）的树脂；一种使用该树脂的组合物；一种固化膜；以及一种制造固化膜和半导体器件的方法。该树脂选自聚酰亚胺前体、聚酰亚胺、聚苯并恶唑前体和聚苯并恶唑，具有可聚合基团，分子量为 1,000 或更小的成分的总含量为 0.005 至 1.0%（质量百分比）。
• Resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10990008B2

  公开（公告）日：2021-04-27

  The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.

  本发明提供了一种树脂组合物，即使在低温下进行热处理，也能形成具有耐化学性、低应力特性和高伸长特性的固化膜。 该树脂组合物包括碱溶性树脂 (a)，它含有具有交联基团的苯酚骨架和不具有交联基团的苯酚骨架，其重量平均分子量在 1,000 至 50,000 之间，其中具有交联基团的苯酚骨架与具有交联基团的苯酚骨架和不具有交联基团的苯酚骨架的结构单元总数的 100%（以摩尔计）的含量比在 5 至 90%（以摩尔计）之间。
• Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11279802B2

  公开（公告）日：2022-03-22

  The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

  本发明提供了一种碱溶性树脂，利用其可以获得具有高延伸性、低应力、对金属的高附着力以及高耐热性的固化膜，并提供含有该碱溶性树脂的光敏树脂组合物。本发明的碱溶性树脂(A)包含由通式(1)表示的结构，其中X1表示具有2至100个碳原子的二价有机基团，Y1和Y2各自表示具有2至100个碳原子的二价至六价有机基团，X2表示具有2至100个碳原子的四价有机基团，p和q各自表示0至4之间的整数，n1和n2各自表示5至100,000之间的整数，并且满足以下(I)和(II)条件： (I) 在通式(1)中，作为X1的含有具有8至30个碳原子的脂肪链的有机基团的含量基于X1和X2的总量为30至70摩尔%； (II) 在通式(1)中，作为Y1的含有二苯醚结构的有机基团的含量基于Y1和Y2的总量为1至30摩尔%。