PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, PROCESS FOR PRODUCING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD
申请人:Hitachi Chemical Company, Ltd.
公开号:EP1174767A1
公开(公告)日:2002-01-23
A photosensitive resin composition comprising (A) a carboxyl group-containing binder polymer which contains styrene or a styrene derivative as a copolymerized constituent, (B) a photo-polymerization initiator, and (C) a photo-polymerizable compound which has in its molecule at least one polymerizable ethylenically unsaturated bond and comprises a compound represented by the general formula (I)
wherein R1 is a hydrogen atom or a methyl group, A is an alkylenoxy group, Z1 is a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an amino group, an alkylamino group, a dialkylamino group, a nitro group, a cyano group, a mercapto group, an alkylmercapto group, an allyl group, a hydroxyalkyl group, a carboxyalkyl group, an acyl group, an alkoxy group or a group containing an heterocyclic group, m is an integer of 4 to 20, and n is an integer of 0 to 5.
一种光敏树脂组合物,包括(A)含羧基的粘合剂聚合物,该聚合物含有苯乙烯或苯乙烯衍生物作为共聚成分;(B)光聚合引发剂;和(C)光可聚合化合物,该化合物分子中至少有一个可聚合的乙烯基不饱和键,并包括通式(I)表示的化合物
其中 R1 是氢原子或甲基,A 是烷基苯氧基,Z1 是卤素原子、烷基、环烷基、芳基、氨基、烷基氨基、二烷基氨基、硝基、氰基巯基、烷基巯基、烯丙基、羟基烷基、羧基烷基、酰基、烷氧基或含有杂环基的基团,m 为 4 至 20 的整数,n 为 0 至 5 的整数。