LOW LOSS DIELECTRIC MATERIAL FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING
申请人:E.I. DU PONT DE NEMOURS AND COMPANY
公开号:EP1500315A1
公开(公告)日:2005-01-26
US6222065B1
申请人:——
公开号:US6222065B1
公开(公告)日:2001-04-24
[EN] LOW LOSS DIELECTRIC MATERIAL FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING<br/>[FR] MATERIAU DIELECTRIQUE A FAIBLE PERTE POUR PLAQUETTES DE CIRCUITS IMPRIMES ET MISE SOUS BOITIER DE MICROCIRCUITS INTEGRES
申请人:DU PONT
公开号:WO2003092342A1
公开(公告)日:2003-11-06
Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.