4,4'-Bis-oxiranyl-biphenyl | 5354-27-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-Bis-oxiranyl-biphenyl
• 英文别名: 2-[4-[4-(Oxiran-2-yl)phenyl]phenyl]oxirane
• CAS: 5354-27-8
• 化学式: C₁₆H₁₄O₂
• 分子量: 238.286
• InChiKey: OWEBGWBRTKTKHR-UHFFFAOYSA-N

物化性质

• 沸点：
  400.3±45.0 °C(Predicted)
• 密度：
  1.235±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  18
• 可旋转键数：
  3
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  25.1
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  4,4'-Bis-oxiranyl-biphenyl 在 乙醇 、 镍 作用下， 生成 2-(4'-ethylbiphenyl-4-yl)ethanol
  参考文献：
  名称：

  据了解芳族二环氧化物和三环氧化物。第三次沟通

  摘要：

  1.以另一种方式再次制备较早显示的1,3,5-三-（环氧乙基）苯，除了已描述的具有1的1,3,5-三（环氧乙基）苯的化合物外，还获得了更高的熔点（熔点为81.5°）。熔点64°。结果表明，这是两个可能的消旋体。

  DOI：

  10.1002/hlca.19590420718
• 作为产物：
  描述：

  1,1'-biphenyl-4,4'-diylbis(2-chloroethanone) 在 氢氧化钾 、 aluminum isopropoxide 、 异丙醇 作用下， 生成 4,4'-Bis-oxiranyl-biphenyl
  参考文献：
  名称：

  据了解芳族二环氧化物和三环氧化物。第三次沟通

  摘要：

  1.以另一种方式再次制备较早显示的1,3,5-三-（环氧乙基）苯，除了已描述的具有1的1,3,5-三（环氧乙基）苯的化合物外，还获得了更高的熔点（熔点为81.5°）。熔点64°。结果表明，这是两个可能的消旋体。

  DOI：

  10.1002/hlca.19590420718

文献信息

• EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1130041A1

  公开（公告）日：2001-09-05

  The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.

  本发明提供了一种环氧树脂组合物，该组合物具有快速固化性和优异的储存稳定性，可用于电子和电气材料领域。也就是说，本发明是一种环氧树脂组合物，包括分子中含有两个或两个以上环氧基团的化合物（A）、分子中含有两个或两个以上酚羟基的共缩合产物（B）和四取代膦（X）的分子缔合产物（C）、分子中含有两个或两个以上酚羟基的化合物（Y），以及分子中含有两个或两个以上酚羟基的化合物（Y）的共轭碱，所述共轭碱是通过从分子中含有两个或两个以上酚羟基的上述化合物（Y）中移除一个氢原子而获得的氧化酚型化合物。
• Semiconductor device encapsulated with epoxy resin composition comprising latent catalyst
  申请人：——

  公开号：US20010021454A1

  公开（公告）日：2001-09-13

  This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

  本发明提供了一种具有硼酸鏻结构的潜催化剂，该结构由四个特定基团与磷原子键合的一价阳离子部分和四个特定基团与硼原子键合的一价阴离子部分组成；本发明还提供了一种具有上述硼酸鏻为循环单元且至少两个所述循环单元通过至少一个与硼原子键合的四个特定基团连接的结构的潜催化剂。本发明还提供了一种包含这种潜伏催化剂的热固性树脂组合物和一种包含这种潜伏催化剂的环氧树脂成型材料，并进一步提供了一种半导体器件，在该半导体器件中，半导体被所述环氧树脂成型材料封装。
• Latent catalyst, thermosetting resin composition comprising the catalyst, epoxy resin molding material comprising the catalyst, and semiconductor device
  申请人：——

  公开号：US20010037003A1

  公开（公告）日：2001-11-01

  This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

  本发明提供了一种具有硼酸鏻结构的潜催化剂，该结构由四个特定基团与磷原子键合的一价阳离子部分和四个特定基团与硼原子键合的一价阴离子部分组成；本发明还提供了一种具有上述硼酸鏻为循环单元且至少两个所述循环单元通过至少一个与硼原子键合的四个特定基团连接的结构的潜催化剂。本发明还提供了一种包含这种潜伏催化剂的热固性树脂组合物和一种包含这种潜伏催化剂的环氧树脂成型材料，并进一步提供了一种半导体器件，在该半导体器件中，半导体被所述环氧树脂成型材料封装。
• Thermosetting resin composition, epoxy resin molding material and semiconductor device respectively using latent catalyst
  申请人：——

  公开号：US20030199391A1

  公开（公告）日：2003-10-23

  This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

  本发明提供了一种具有硼酸鏻结构的潜催化剂，该结构由四个特定基团与磷原子键合的一价阳离子部分和四个特定基团与硼原子键合的一价阴离子部分组成；本发明还提供了一种具有上述硼酸鏻为循环单元且至少两个所述循环单元通过至少一个与硼原子键合的四个特定基团连接的结构的潜催化剂。本发明还提供了一种包含这种潜伏催化剂的热固性树脂组合物和一种包含这种潜伏催化剂的环氧树脂成型材料，并进一步提供了一种半导体器件，在该半导体器件中，半导体被所述环氧树脂成型材料封装。
• Latent catalyst
  申请人：——

  公开号：US20040034125A1

  公开（公告）日：2004-02-19

  This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

  本发明提供了一种具有硼酸鏻结构的潜催化剂，该结构由四个特定基团与磷原子键合的一价阳离子部分和四个特定基团与硼原子键合的一价阴离子部分组成；本发明还提供了一种具有上述硼酸鏻为循环单元且至少两个所述循环单元通过至少一个与硼原子键合的四个特定基团连接的结构的潜催化剂。本发明还提供了一种包含这种潜伏催化剂的热固性树脂组合物和一种包含这种潜伏催化剂的环氧树脂成型材料，并进一步提供了一种半导体器件，在该半导体器件中，半导体被所述环氧树脂成型材料封装。