MALIEVSKIJ, A. D.;GORBUNOVA, O. I., IZV. AN CCCP. CEP. XIM., 1981, N 10, 2307-2309
作者:MALIEVSKIJ, A. D.、GORBUNOVA, O. I.
DOI:——
日期:——
SADYX-ZADE S. I.; MAMEDOV R. M.; MAMEDOVA B. M.; BABAEV N. M., AZEHRB. KIMJA ZH., AZERB. XIM. ZH, 1978, HO 1, 36-38
作者:SADYX-ZADE S. I.、 MAMEDOV R. M.、 MAMEDOVA B. M.、 BABAEV N. M.
DOI:——
日期:——
US20150259814A1
申请人:——
公开号:US20150259814A1
公开(公告)日:2015-09-17
US9273407B2
申请人:——
公开号:US9273407B2
公开(公告)日:2016-03-01
[EN] PLATING LEVELER FOR ELECTRODEPOSITION OF COPPER PILLAR<br/>[FR] AGENT DE NIVELLEMENT DE DÉPÔT POUR DÉPÔT ÉLECTROCHIMIQUE DE PILIER DE CUIVRE
申请人:HONG KONG APPLIED SCIENCE & TECH RES INST COMPANY LTD
公开号:WO2017113439A1
公开(公告)日:2017-07-06
Provided are a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.