1,4-phenylene diformate | 33104-35-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,4-phenylene diformate
• 英文别名: 1,4-Diformyloxybenzol；(4-Formyloxyphenyl) formate
• CAS: 33104-35-7
• 化学式: C₈H₆O₄
• 分子量: 166.133
• InChiKey: WWGWOVMJTUUNSA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  12
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  52.6
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  1,4-phenylene diformate 在 1,1-二氯甲醚 、 mercury dichloride 作用下， 生成 p-Phenylenbis(dichlormethyl)aether
  参考文献：
  名称：

  Holsboer,D.H. et al., Recueil des Travaux Chimiques des Pays-Bas, 1971, vol. 90, p. 556 - 561

  摘要：

  DOI：
• 作为产物：
  描述：

  二甲酰氨基钠 、 对苯二酚 在 甲基磺酰氯 作用下， 以 乙腈 为溶剂， 反应 4.0h， 以78%的产率得到1,4-phenylene diformate
  参考文献：
  名称：

  一种由酚类制备甲酸芳基酯的简便新方法

  摘要：

  摘要 甲酸芳基酯是通过两步一锅法从苯酚制备的。首先，甲酰化试剂三甲酰胺 (1b) 由二甲酰胺钠 (2) 和甲磺酰氯原位生成，其与苯酚 4a - f 反应以良好的产率得到甲酸芳基酯 5a - f。原位制备的三甲酰胺在氯化铝存在下将苯甲醚转化为 N-（二芳基甲基）甲酰胺 7。

  DOI：

  10.1515/znb-2008-0414

文献信息

• Mono carbonylation of benzene diols
  申请人：——

  公开号：US20040260114A1

  公开（公告）日：2004-12-23

  A process for a mono carbonylation of a benzenediol of the formula (I) is characterized in that a benzene diol of the formula (II) is reacted with an acid anhydride or carbonyl halide of the formula (III) without any organic or inorganic bases for thereby producing a monocarbonylated benzenediol of the formula (I): 1 wherein R is hydrogen, C 1 -C 15 alkyl group, cycle alkyl group, aryl group, alkoxy group, aryloxy group, dialkylamino group, alkylarylamino group or diarylamino group, and X is a general leaving group such as fluoride, chloride, bromide, iodide, acetoxy, etc.

  一种单羰基化苯二酚的方法，其特点在于将化学式（II）的苯二酚与化学式（III）的酸酐或羰基卤化物反应，而不使用任何有机或无机碱，从而产生化学式（I）的单羰基化苯二酚：1其中R是氢、C1-C15烷基、环烷基、芳基、烷氧基、芳氧基、二烷基氨基、烷基芳基氨基或二芳基氨基，X是一般的离去基，如氟、氯、溴、碘、乙酰氧等。
• Thiazole derivatives, their preparation and their use in the treatment of diabetes complications
  申请人：Sankyo Company Limited

  公开号：EP0337819A1

  公开（公告）日：1989-10-18

  Compounds of formula (I): in which: R1 and R2 are independently hydrogen, alkyl, aliphatic hydrocarbon groups having one or two carbon-carbon double or treble bonds, cycloalkyl, aryl, substituted aryl, aralkyl, substituted aralkyl, alkanoyl, alkenoyl, cycloalkylcarbonyl, arylcarbonyl, substituted arylcaronyl, arylalkanoyl, substituted arylalkanoyl, arylalkenoyl, substituted arylalkenoyl, alkoxycarbonyl, aryloxycarbonyl, substituted aryloxycarbonyl, aralkyloxycarbonyl, substituted aralkyloxycarbonyl, optionally substituted carbamoyl or thiocarbamoyl, alkylsulphonyl, haloalkylsulphonyl, arylsulphonyl, substituted arylsulphonyl, alkylthio, arylthio and substituted arylthio, or R1 and R2, together with the nitrogen atom to which they are attached, form a nitrogen-containing heterocyclic group; one of Ra and Rb is hydrogen, alkyl or halogen, and the other of Ra and Rb is a group of formula (II): R4 is hydrogen, carboxy, protected carboxy or optionally substituted carbamoyl; R5 is hydrogen, or carboxyalkyl or protected carboxyalkyl in which the alkyl part is C1 -Cs; n = 0, 1 or 2; X is oxygen or sulphur; are useful in the treatment of the complications attendant upon diabetes and may be prepared by condensation of a thiazolidine or rhodanine compound with a compound corresponding to the remainder of the molecule of the compound of formula (I).

  式(I)化合物： 其中 R1 和 R2 独立地为氢、烷基、具有一个或两个碳碳双键或三键的脂族烃基、环烷基、芳基、取代芳基、烷酰基、烯酰基、环烷基羰基、芳基羰基、取代芳基羰基、芳基烷酰基、取代芳基烷酰基、芳基烯酰基、取代芳基烯酰基、烷氧基羰基、芳氧基羰基、芳氧基羰基、芳烷氧基羰基、取代芳氧基羰基、芳烷氧基羰基、芳烷氧基羰基、取代芳烷氧基羰基、选择性取代氨基甲酰基或硫代氨基甲酰基、烷氧基羰基、芳氧基羰基、取代的芳氧基羰基、烷氧基羰基、取代的芳氧基羰基、任选取代的氨基甲酰基或硫代氨基甲酰基、烷基磺酰基、卤代烷基磺酰基、芳基磺酰基、取代的芳基磺酰基、烷硫基、芳硫基和取代的芳硫基，或 R1 和 R2 与它们所连接的氮原子一起形成含氮杂环基团；Ra 和 Rb 中的一个是氢、烷基或卤素，Ra 和 Rb 中的另一个是式 (II) 基团： R4 是氢、羧基、受保护的羧基或任选取代的氨基甲酰基；R5 是氢、羧基烷基或受保护的羧基烷基，其中烷基部分是 C1-Cs；n = 0、1 或 2；X 是氧或硫； 可通过噻唑烷或罗丹宁化合物与对应于式（I）化合物分子剩余部分的化合物缩合制备。
• THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM
  申请人：DIC Corporation

  公开号：EP2589625A1

  公开（公告）日：2013-05-08

  The present invention provides a thermosetting resin composition exhibiting excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent when formed into a cured product, a cured product thereof, an active ester resin which develops these properties, and a semiconductor encapsulating material, a prepreg, a circuit board, and a build-up film which are produced using the composition. A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

  本发明提供了一种热固性树脂组合物，该组合物在形成固化物时具有优异的耐热性和阻燃性，同时还能保持低介电常数和低介电损耗正切，本发明还提供了一种固化物、一种具有这些特性的活性酯树脂，以及使用该组合物生产的半导体封装材料、预浸料、电路板和积层膜。一种热固性树脂组合物含有活性酯树脂（A）和环氧树脂（B）作为基本成分，活性酯树脂（A）具有包括聚芳氧基结构（I）的树脂结构，其中多个聚芳氧基结构（I）中的芳香族碳原子通过结构式 1 所表示的结构位点（II）连接（其中 Ar 代表苯基、被 1 至 3 个各具有 1 至 4 个碳原子的烷基核取代的亚苯基、萘基或被 1 至 3 个各具有 1 至 4 个碳原子的烷基核取代的萘基）。
• Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film
  申请人：DIC Corporation

  公开号：US10059798B2

  公开（公告）日：2018-08-28

  An active ester resin having a molecular structure represented by Structural Formula (1) where X represents a benzene ring or a naphthalene ring, each R1 independently represents a methyl group or a hydrogen atom, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5. The active ester resin, as a curing agent, can be combined with an epoxy resin to form at least an epoxy resin composition, a cured product, a prepreg, a circuit board and a build-up film.

  活性酯树脂 其分子结构由结构式(1)表示 其中 X 代表苯环或萘环，每个 R1 独立地代表甲基或氢原子，k 为 0 或 1，n 为 1 或 2，l 为 1 或 2，m 为重复单元的平均值，范围为 0.25 至 1.5。活性酯树脂作为固化剂，可与环氧树脂结合，至少形成一种环氧树脂组合物、一种固化产品、一种预浸料、一种电路板和一层薄膜。
• Display panel, preparation method thereof, and liquid crystal display
  申请人：SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

  公开号：US10824023B2

  公开（公告）日：2020-11-03

  The present disclosure provides a display panel, a preparation method thereof, and a liquid crystal display. The display panel includes a first substrate, a second substrate opposite to the first substrate, a liquid crystal layer between the first substrate and the second substrate, and a polymerizable monomer arranged in the liquid crystal layer; wherein a plurality of polymer walls are arranged in the liquid crystal layer; the polymer wall contacts to the first substrate and the second substrate, and a polymerization direction of the polymerizable monomer in the polymer wall is substantially perpendicular to a thickness direction of the polymer wall. By arranging a plurality of polymer walls to limit the flow of the liquid crystal in a liquid crystal layer, improve an edge roughness of a polymer wall, so as to improve light leakage from an edge of pixels and improve a display effect.

  本公开提供了一种显示面板、其制备方法和液晶显示器。该显示面板包括第一基板、与第一基板相对的第二基板、位于第一基板和第二基板之间的液晶层以及布置在液晶层中的可聚合单体；其中，液晶层中布置有多个聚合物壁；聚合物壁与第一基板和第二基板接触，聚合物壁中的可聚合单体的聚合方向与聚合物壁的厚度方向基本垂直。通过布置多个聚合物壁来限制液晶层中液晶的流动，改善聚合物壁的边缘粗糙度，从而改善像素边缘的漏光情况，提高显示效果。