The invention relates to an aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces, said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom as well as to a method for the inhibition of an insulated surface of a rack area. The inventive inhibition composition is capable to provide a solution for prohibiting unintended metallization on insulated areas of the racks when non-chromic etching is utilized for plating on plastics processes.
本发明涉及一种用于抑制聚合物表面电
化学金属电镀的
水性抑制组合物,所述抑制组合物包含一种选自至少有一个
硫原子和至少有一个氮原子的化合物组的
抑制剂,还涉及一种抑制机架绝缘表面的方法。本发明的
抑制剂组合物能够提供一种解决方案,当在塑料电镀工艺中使用非变色蚀刻法时,禁止在机架的绝缘区域出现意外
金属化。