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8-allyl-3-(benzocyclobutene-4-yl)-3,4-dihydro-2H-benzo[e][1,3]-oxazine | 1369970-30-8

中文名称
——
中文别名
——
英文名称
8-allyl-3-(benzocyclobutene-4-yl)-3,4-dihydro-2H-benzo[e][1,3]-oxazine
英文别名
3-(3-Bicyclo[4.2.0]octa-1(6),2,4-trienyl)-8-prop-2-enyl-2,4-dihydro-1,3-benzoxazine;3-(3-bicyclo[4.2.0]octa-1(6),2,4-trienyl)-8-prop-2-enyl-2,4-dihydro-1,3-benzoxazine
8-allyl-3-(benzocyclobutene-4-yl)-3,4-dihydro-2H-benzo[e][1,3]-oxazine化学式
CAS
1369970-30-8
化学式
C19H19NO
mdl
——
分子量
277.366
InChiKey
JMQWFXVKECBFKX-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    4
  • 重原子数:
    21
  • 可旋转键数:
    3
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.26
  • 拓扑面积:
    12.5
  • 氢给体数:
    0
  • 氢受体数:
    2

反应信息

  • 作为产物:
    描述:
    聚合甲醛4-氨基苯并环丁烯2-烯丙基酚甲苯 为溶剂, 以80%的产率得到8-allyl-3-(benzocyclobutene-4-yl)-3,4-dihydro-2H-benzo[e][1,3]-oxazine
    参考文献:
    名称:
    Synthesis and Properties of Highly Cross-Linked Thermosetting Resins of Benzocyclobutene-Functionalized Benzoxazine
    摘要:
    Benzocyclobutene- (BCB-) functionalized benzoxazine (BOZ) monomers and resins have been successfully prepared. BCB-functionalized BOZ monomers were synthesized by the reaction of 4-aminobenzocyclobutene (AMBCB), phenol and paraformaldehyde or by the reaction of 4-hydroxylbenzocyclobutene (OHBCB), arylamine, and paraformaldehyde in toluene under reflux. Fourier transform infrared spectroscopy (FTIR), H-1 and C-13 nuclear magnetic resonance spectroscopy (NMR) are used to characterize the structure of the monomers. The monomers possess two kinds of ring-opening polymerizable functional groups of BCB and BOZ. So the monomers can be cured at proper temperature to prepare highly cross-linked resins. The polymerization behavior of the monomers is studied by differential scanning calorimetry (DSC) and FTIR DMA study demonstrates that these polymers show high storage moduli which can be maintained in a wide temperature range up to 300 degrees C and high T-g at ca. 350 degrees C. The TGA study shows that the cured resins possess good thermal stability.
    DOI:
    10.1021/ma3004218
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