3,3'-diethoxy-biphenyl-4,4'-diyl diisocyanate | 109725-01-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-diethoxy-biphenyl-4,4'-diyl diisocyanate
• 英文别名: 3,3'-Diaethoxy-biphenyl-4,4'-diyldiisocyanat；2-Ethoxy-4-(3-ethoxy-4-isocyanatophenyl)-1-isocyanatobenzene
• CAS: 109725-01-1
• 化学式: C₁₈H₁₆N₂O₄
• 分子量: 324.336
• InChiKey: BEQLTRYJXVJANR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  24
• 可旋转键数：
  7
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.22
• 拓扑面积：
  77.3
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为反应物：
  描述：

  3,3'-diethoxy-biphenyl-4,4'-diyl diisocyanate 、 苯胺 生成 N',N'''-diphenyl-N,N''-(3,3'-diethoxy-biphenyl-4,4'-diyl)-di-urea
  参考文献：
  名称：

  Synthese von makromolekeln einheitlicher größe. II. Mitt. Synthese neuer diol-oligo-urethane nach dem duplikationsverfahren.

  摘要：

  AbstractNeue Diol‐di‐ und Diol‐hexa‐urethane werden synthetisiert. Als Komponenten dienen aromatische Diisocyanate vom Arylen‐, Diarylen‐ und Naphthylentyp und aliphatische Diisocyanate; als Diole werden Oligo‐methylendiole, wie 1,4‐Butandiol, und Diole mit Heteroatomen, wie Diglykol, N‐Alkyldiäthanolamine u. a. angewandt. Es werden besser lösliche Oligo‐urethane erhalten, die zur Durchführung des Duplikationsverfahrens geeingeter sind. Es werden mehrere neue Diisocyanate hergestellt. Zur Charakterisierung der Diol‐oligo‐urethane werden bromsubstituierte Phenylisocyanate angewandt.

  DOI：

  10.1002/macp.1955.020160113
• 作为产物：
  描述：

  光气 、 4,4'-diamino-3,3'-diethoxybiphenyl 生成 3,3'-diethoxy-biphenyl-4,4'-diyl diisocyanate
  参考文献：
  名称：

  Synthese von makromolekeln einheitlicher größe. II. Mitt. Synthese neuer diol-oligo-urethane nach dem duplikationsverfahren.

  摘要：

  AbstractNeue Diol‐di‐ und Diol‐hexa‐urethane werden synthetisiert. Als Komponenten dienen aromatische Diisocyanate vom Arylen‐, Diarylen‐ und Naphthylentyp und aliphatische Diisocyanate; als Diole werden Oligo‐methylendiole, wie 1,4‐Butandiol, und Diole mit Heteroatomen, wie Diglykol, N‐Alkyldiäthanolamine u. a. angewandt. Es werden besser lösliche Oligo‐urethane erhalten, die zur Durchführung des Duplikationsverfahrens geeingeter sind. Es werden mehrere neue Diisocyanate hergestellt. Zur Charakterisierung der Diol‐oligo‐urethane werden bromsubstituierte Phenylisocyanate angewandt.

  DOI：

  10.1002/macp.1955.020160113

文献信息

• INSULATED WIRE
  申请人：THE FURUKAWA ELECTRIC CO., LTD.

  公开号：EP0977209A1

  公开（公告）日：2000-02-02

  There is disclosed an insulated wire, which comprises at least one insulating layer toned by applying and baking, directly or via another insulating layer on a conductor, a resin composition containing at least one selected from the group consisting of a polyamidimide resin and a polyimide resin, each having, in the molecular structure of the resin, a structure represented by formula (I), and/or a resin composition containing at least one selected from the group consisting of a polyamidimide resin and a polyimide resin, each having, in the molecular structure of the resin, a structure represented by formula (II), and said insulated wire has 0.2% yield stress of not more than 110 Mpa. This insulated wire, even if its insulation coating is made thinner, is excellent in resistance to scratches, and it is able to prevent the coating from breakage at the time of coil working, especially of the insertion of a coil into a stator slot, under rigorous conditions. In the formulae, R1, R2, R3, and R4, each are a hydrogen atom, an alkyl group, a hydroxyl group, a halogen atom, or an alkoxy group.

  本发明公开了一种绝缘电线，该电线包括至少一个绝缘层，该绝缘层是通过在导体上直接或通过另一个绝缘层涂敷和烘烤而调色的，该绝缘层是一种树脂组合物，该树脂组合物含有至少一种选自由聚酰胺酰亚胺树脂和聚酰亚胺树脂组成的组中的一种，每种树脂的分子结构中都具有式（I）所代表的结构，和/或一种树脂组合物，该树脂组合物含有至少一种选自由聚酰胺酰亚胺树脂和聚酰亚胺树脂组成的组中的一种，每种树脂的分子结构中都具有式（I）所代表的结构、或含有至少一种选自聚酰胺酰亚胺树脂和聚酰亚胺树脂组成的组的树脂组合物，每种树脂的分子结构均具有式 (II) 所表示的结构，且所述绝缘线具有 0.2% 的屈服应力不超过 110 兆帕。这种绝缘导线即使绝缘层变薄，也具有极佳的抗划伤能力，在线圈工作时，特别是在将线圈插入定子槽中的严格条件下，能够防止绝缘层破损。 式中，R1、R2、R3 和 R4 各为氢原子、烷基、羟基、卤素原子或烷氧基。
• MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT AND ELECTRICAL/ELECTRONIC COMPONENT
  申请人：The Furukawa Electric Co., Ltd.

  公开号：EP2248663A1

  公开（公告）日：2010-11-10

  A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure: in which R1, R2, R3, and R4 each represent one selected from a hydrogen atom, an alkyl group, a hydroxyl group, a halogen atom, and an alkoxy group.

  一种用于电气/电子零件的材料，该材料的树脂涂层直接形成于金属基板的至少一部分或金属基板上的金属层的至少一部分，树脂涂层由树脂组合物形成，该树脂组合物包含至少一种从聚酰胺酰亚胺树脂和聚酰亚胺树脂组成的组中选出的树脂组合物，每种树脂组合物的分子结构由式（I）或（II）表示： 其中 R1、R2、R3 和 R4 各代表一个选自氢原子、烷基、羟基、卤素原子和烷氧基的基团。
• Insulated wire
  申请人：SUMITOMO ELECTRIC INDUSTRIES, LTD

  公开号：EP0543409B1

  公开（公告）日：1996-07-17
• Enamel Varnish Composition For Enamel Wire And Enamel Wire Using The Same
  申请人：Lee Joon-Hee

  公开号：US20080176072A1

  公开（公告）日：2008-07-24

  Disclosed are enamel varnish compositions for an enamel wire and an enamel wire using the same. The present invention relates to enamel varnish compositions for an enamel wire in which a polymeric resin component is included in an organic solvent, wherein the polymeric resin component includes a first polyamideimide resin, presented in the Chemistry FIG. 1; and a second resin having polyamideimide in which a triazine ring is introduced into a major chain. The enamel wire, in which such a coating pigment composition is applied to the innermost insulated coating layer contacted with the conducting wire, shows the increased adhesivity of the insulated coating layer to the conducting wire without forming an additional bonding layer, as well as the excellent physical properties such as the wear resistance and flexibility, etc.
• ENAMEL VARNISH COMPOSITION FOR ENAMEL WIRE AND ENAMEL WIRE USING SAME
  申请人：Lee Joon-Hee

  公开号：US20090202830A1

  公开（公告）日：2009-08-13

  Disclosed are enamel varnish compositions for an enamel wire and an enamel wire using the same. The present invention relates to enamel varnish compositions for an enamel wire in which a polymeric resin component is included in an organic solvent, wherein the polymeric resin component includes a first polyamideimide resin; and a second resin having polyamideimide in which a triazine ring is introduced into a major chain. The enamel wire, in which such a coating pigment composition is applied to the innermost layer, has the increased adhesivity of the insulated coating layer to the conducting wire, as well as the excellent physical properties such as the wear resistance and flexibility, etc.