2,2-bis{4,4-bis(4-hydroxy-5-methylphenyl)cyclohexyl}propane | 53091-59-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2-bis{4,4-bis(4-hydroxy-5-methylphenyl)cyclohexyl}propane
• 英文别名: 4-[4-[2-[4,4-Bis(4-hydroxy-3-methylphenyl)cyclohexyl]propan-2-yl]-1-(4-hydroxy-3-methylphenyl)cyclohexyl]-2-methylphenol
• CAS: 53091-59-1
• 化学式: C₄₃H₅₂O₄
• 分子量: 632.883
• InChiKey: UWFTYJMSFDVFHY-UHFFFAOYSA-N

物化性质

• 沸点：
  756.4±60.0 °C(Predicted)
• 密度：
  1.155±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  12.7
• 重原子数：
  47
• 可旋转键数：
  6
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.44
• 拓扑面积：
  80.9
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  2,2-bis{4,4-bis(4-hydroxy-5-methylphenyl)cyclohexyl}propane 在 乌洛托品 、 potassium carbonate 、 三氟乙酸 、 potassium iodide 、 sodium hydroxide 作用下， 以 N-甲基吡咯烷酮 、 水 为溶剂， 反应 31.5h， 生成 2,2-bis{4,4-bis(3-formyl-4-methoxycarbonylmethoxy-5-methylphenyl)cyclohexyl}propane
  参考文献：
  名称：

  TETRAKIS(ETHER-SUBSTITUTED FORMYLPHENYL) AND NEW POLYNUCLEAR POLYPHENOL DERIVED FROM THE SAME

  摘要：

  通用公式（1）表示的四（醚取代甲酰基苯基）以及由此类四（醚取代甲酰基苯基）衍生的多核多酚已公开：（在公式中，R1代表具有1至8个碳原子的烷基基团或具有1至8个碳原子的烷氧基团，或具有具有芳香烃基的1至8个碳原子的芳香烃基或饱和碳氢基团，n代表0或1至3的整数，R2代表具有6至15个碳原子的二价单环或融合环芳香烃基团或具有1至8个碳原子的二价脂肪碳氢基团，该基团可能具有具有6至15个碳原子的单环或融合环芳香烃基团，R3代表氢原子或具有1至6个碳原子的烷基基团，A代表四价碳原子基团或具有2个或更多碳原子的四价饱和碳氢基团，如果A是具有2个或更多碳原子的四价饱和碳氢基团，则A基团中的两个碳原子分别与两个苯基团结合。）

  公开号：

  US20110172457A1

文献信息

• NOVEL POLYNUCLEAR POLY(PHENOL) FAMILY
  申请人：Iwai Tatsuya

  公开号：US20120277479A1

  公开（公告）日：2012-11-01

  Provided is a polynuclear poly(phenol)family represented by general formula (1). In general formula (1), R 1 s are each independently C 1-8 alkyl group, C 1-8 alkoxy group, an aromatic hydrocarbon group, or a C 1-8 saturated hydrocarbon group having an aromatic hydrocarbon group; n is 0 or an integer of 1 to 3; X is a hydroxyphenyl group represented by general formula (2); and A is a tetravalent carbon atom group or a tetravalent saturated hydrocarbon group having two or more carbon atoms, with the proviso that when A is a tetravalent saturated hydrocarbon group having two or more carbon atoms, two carbon atoms in the A group are each bonded to two phenyl groups.

  提供的是由一般式（1）表示的多核多酚家族。在一般式（1）中，R1分别是C1-8烷基基团、C1-8烷氧基团、芳香烃基团或具有芳香烃基团的C1-8饱和碳氢基团；n为0或1到3的整数；X为由一般式（2）表示的羟基苯基团；A为四价碳原子基团或具有两个或更多碳原子的四价饱和碳氢基团，但当A为具有两个或更多碳原子的四价饱和碳氢基团时，A基团中的两个碳原子分别与两个苯基结合。
• BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT
  申请人：Terakawa Koji

  公开号：US20100044888A1

  公开（公告）日：2010-02-25

  A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.

  本发明提供了一种在两个氨基团相邻位置上具有取代基的双(氨基酚)衍生物。该双(氨基酚)衍生物用作聚酰胺树脂的原材料，用于制备正向感光树脂组合物。还提供了一种聚酰胺树脂，包括双(氨基酚)和由羧酸衍生的结构，其中双(氨基酚)在两个氨基团相邻位置上具有取代基。提供了一种正向感光树脂组合物，包括聚苯并噁唑前体树脂，即使在低温下固化，也表现出高灵敏度和高环化速率。还提供了一种正向感光树脂组合物，包括具有酰亚胺结构、酰亚胺前体结构或酰胺酸酯结构的聚酰胺树脂。该组合物表现出高灵敏度，即使在低温下固化，也能产生低吸水性的固化产物。
• Mask blank, method for manufacturing mask blank and transfer mask
  申请人：HOYA CORPORATION

  公开号：US10042247B2

  公开（公告）日：2018-08-07

  There is provided a mask blank including on a substrate: a thin film for forming a transfer pattern; a resist underlayer formed on the thin film and made of a resist underlayer composition containing a polymer having a unit structure having a lactone ring and a unit structure having a hydroxyl group; a resist film formed on the resist underlayer film and made of a resist composition; and a mixed film formed so as to be interposed between the resist underlayer film and the resist film and made of a mixed component containing the resist underlayer composition and the resist composition.

  本发明提供了一种掩膜坯料，其基板上包括：用于形成转印图案的薄膜；形成在薄膜上的抗蚀剂底层，由抗蚀剂底层组合物制成，该抗蚀剂底层组合物含有具有内酯环的单元结构和具有羟基的单元结构的聚合物；形成在抗蚀剂底层薄膜上的抗蚀剂薄膜，由抗蚀剂组合物制成；以及形成在抗蚀剂底层薄膜和抗蚀剂薄膜之间的混合薄膜，由含有抗蚀剂底层组合物和抗蚀剂组合物的混合成分制成。
• Electron beam resist underlayer film-forming composition containing lactone-structure-containing polymer
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US10289002B2

  公开（公告）日：2019-05-14

  An electron beam resist underlayer film-forming composition includes a polymer containing a unit structure having a lactone ring and a unit structure having a hydroxy group. The polymer may be a polymer obtained by copolymerizing a monomer mixture containing a lactone (meth)acrylate, a hydroxyalkyl (meth)acrylate, and phenyl (meth)acrylate or benzyl (meth)acrylate. A method for producing a semiconductor device including: applying the electron beam resist underlayer film-forming composition onto a substrate and heating the applied composition to form an electron beam resist underlayer film; coating the electron beam resist underlayer film with an electron beam resist; irradiating the substrate coated with the electron beam resist underlayer film and the electron beam resist with an electron beam; developing the substrate; and transferring an image onto the substrate by dry etching to form an integrated circuit element.

  一种电子束抗蚀剂底层成膜组合物包括一种聚合物，该聚合物含有一个具有内酯环的单元结构和一个具有羟基的单元结构。该聚合物可以是通过共聚含有内酯（甲基）丙烯酸酯、羟基烷基（甲基）丙烯酸酯和苯基（甲基）丙烯酸酯或苄基（甲基）丙烯酸酯的单体混合物而得到的聚合物。一种生产半导体器件的方法，包括：将电子束抗蚀剂底层成膜组合物涂在基片上并加热所涂组合物以形成电子束抗蚀剂底层膜；用电子束抗蚀剂涂覆电子束抗蚀剂底层膜；用电子束照射涂有电子束抗蚀剂底层膜和电子束抗蚀剂的基片；显影基片；以及通过干蚀刻将图像转移到基片上以形成集成电路元件。
• Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10831101B2

  公开（公告）日：2020-11-10

  A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

  一种光敏树脂组合物含有一种树脂和一种化合物，每种树脂和化合物都具有本说明书规定的结构，这种组合物提供的固化薄膜对铜线具有极佳的粘合性。