3-(4-丙基苯氧基)-苯胺 | 887579-65-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 3-(4-丙基苯氧基)-苯胺
• 英文名称: 3-(4-Propyl-phenoxy)-phenylamine
• 英文别名: 3-(4-propylphenoxy)aniline
• CAS: 887579-65-9
• 化学式: C₁₅H₁₇NO
• mdl: MFCD06656969
• 分子量: 227.3
• InChiKey: MUGUJRSYUSHCBS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.1
• 重原子数：
  17
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  35.2
• 氢给体数：
  1
• 氢受体数：
  2

文献信息

• POLYIMIDE RESIN, RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE COMPRISING THE SAME, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE
  申请人：Kaneka Corporation

  公开号：EP1193280A1

  公开（公告）日：2002-04-03

  The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): wherein X represents -(CH2)k-, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.

  本发明提供了一种可溶于溶剂的聚酰亚胺树脂、树脂组合物、粘合剂溶液、膜态接合成分和粘合层压膜，具有优异的耐热性和粘合性，能够在相对较低的温度下粘合和固化。具体地说，本发明提供了一种吸水性低的新型聚酰亚胺树脂，它是由含有通式 (1) 所代表的酯酸二酐的四羧酸二酐反应得到的： 其中 X 代表-(CH2)k-，或者是由芳香环组成的二价基团，k 是 1 至 10 的整数；和芳香二胺，其中树脂组合物和薄膜状态连接组分由具有优异粘合性的热固性树脂组成，使用这种树脂最好用于柔性印刷电路板、TAB（胶带自动粘合）用胶带、复合引线框架和层压材料或类似材料，以及适用于涂覆超导线棒的粘合层压薄膜。
• Composition and associated method
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1783147A1

  公开（公告）日：2007-05-09

  Provided is a fluorine substituted oligomeric or polymeric ester including the reaction product of a fluorine substituted acrylate or a fluorine substituted methacrylate; an unsaturated anhydride; and an alkyl acrylate or an alkyl methacrylate. Also provided is a method of making the composition.

  本发明提供了一种氟取代低聚物或聚合物酯，包括氟取代丙烯酸酯或氟取代甲基丙烯酸酯、不饱和酸酐和丙烯酸烷基酯或甲基丙烯酸烷基酯的反应产物。此外，还提供了一种制造该组合物的方法。
• Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor
  申请人：——

  公开号：US20030045669A1

  公开（公告）日：2003-03-06

  The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures. Specifically, the present invention provides a novel polyimide resin having low water absorption obtained by a reaction between tetracarboxylic acid dianhydride containing ester-acid dianhydride represented by the general formula (1): 1 wherein X represents —(CH 2 ) k —, or is a divalent group which comprises an aromatic ring, and k is an integer from 1 to 10; and aromatic diamine, where the resin composition and the film-state joining component which comprise a thermosetting resin with excellent adhesion using this resin are preferably used for flexible printed circuit boards, tapes for TAB (Tape Automated Bonding), composite lead frames, and lamination materials, or the like, and an adhesive laminate film suitable for coating of a superconductive wire rod.

  本发明提供了一种可溶于溶剂的聚酰亚胺树脂、树脂组合物、粘合剂溶液、膜态接合成分和粘合层压膜，具有优异的耐热性和粘合性，能够在相对较低的温度下粘合和固化。具体地说，本发明提供了一种吸水性低的新型聚酰亚胺树脂，它是由含有通式（1）所代表的酯酸二酐的四羧酸二酐反应得到的： 1 其中 X 代表-(CH 2 ) k -或包含芳香环的二价基团，且 k 是 1 到 10 的整数；以及芳香族二胺，其中树脂组合物和薄膜态连接组分包含具有优异粘合性的热固性树脂，使用这种树脂最好用于柔性印刷电路板、TAB（胶带自动粘合）胶带、复合引线框架和层压材料或类似材料，以及适用于涂覆超导线棒的粘合层压膜。
• POLYIMIDE RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE
  申请人：Kaneka Corporation

  公开号：EP1193280B1

  公开（公告）日：2004-11-24
• US5512641A
  申请人：——

  公开号：US5512641A

  公开（公告）日：1996-04-30