申请人:ASAHI KASEI KABUSHIKI KAISHA
公开号:US10301517B2
公开(公告)日:2019-05-28
A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions:
(I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase;
(I-II) the softening point of the epoxy resin (A) is 35° C. or higher;
(I-III) the residual solvent in the resin composition is no greater than 0.1%; and
(I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.
一种树脂组合物至少包括 (A) 环氧树脂、(B) 固化剂和 (C) 无机填料,并满足以下条件:
(I-I)在设定温度为 200 摄氏度时,用流变仪以 50 摄氏度/分钟的速度将温度从室温升至 200 摄氏度后进行评估,最小模量不大于 104 兆帕,且在初始温度升高 10 分钟后,最终模量大于或等于 105 兆帕;
(I-II) 环氧树脂 (A) 的软化点为 35 摄氏度或更高;
(I-III) 树脂组合物中的残留溶剂不大于 0.1%;及
(I-IV) 固化剂 (B) 的当量不大于 90 克/当量,软化点为 105 摄氏度或更高。