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Phenol, 4,4'-cyclohexylidenebis[2-amino- | 30817-90-4

中文名称
——
中文别名
——
英文名称
Phenol, 4,4'-cyclohexylidenebis[2-amino-
英文别名
2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol
Phenol, 4,4'-cyclohexylidenebis[2-amino-化学式
CAS
30817-90-4
化学式
C18H22N2O2
mdl
——
分子量
298.4
InChiKey
BOVSSHUURZCDRR-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    4.1
  • 重原子数:
    22
  • 可旋转键数:
    2
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.33
  • 拓扑面积:
    92.5
  • 氢给体数:
    4
  • 氢受体数:
    4

文献信息

  • POLYIMIDE SOLUTION, HEAT-RESISTANT NON-WOVEN FABRIC, AND METHOD FOR MANUFACTURING SAME
    申请人:Toray Industries, Inc.
    公开号:EP3216819A1
    公开(公告)日:2017-09-13
    The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol% or more, based on the total amount of the resin, of a structural unit represented by the general formula (1) ; and (b) a solvent.
    本发明提供了一种聚酰亚胺溶液,该溶液在获得耐热聚酰亚胺无纺布时不需要在高 温下进行闭环处理,并且在通过电纺丝生产纤维时几乎不受大气湿度的影响,因此在任 何情况下都可以获得直径稳定的纤维。 一种聚酰亚胺溶液,包括:(a)一种树脂,其通式(1)所代表的结构单元含量占树脂总量的 50 摩尔%或以上;以及(b)一种溶剂。
  • Thermosetting resin composition
    申请人:ASAHI KASEI KABUSHIKI KAISHA
    公开号:US10301517B2
    公开(公告)日:2019-05-28
    A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.
    一种树脂组合物至少包括 (A) 环氧树脂、(B) 固化剂和 (C) 无机填料,并满足以下条件: (I-I)在设定温度为 200 摄氏度时,用流变仪以 50 摄氏度/分钟的速度将温度从室温升至 200 摄氏度后进行评估,最小模量不大于 104 兆帕,且在初始温度升高 10 分钟后,最终模量大于或等于 105 兆帕; (I-II) 环氧树脂 (A) 的软化点为 35 摄氏度或更高; (I-III) 树脂组合物中的残留溶剂不大于 0.1%;及 (I-IV) 固化剂 (B) 的当量不大于 90 克/当量,软化点为 105 摄氏度或更高。
  • Liquid crystal alignment composition, liquid crystal alignment film and liquid crystal display element
    申请人:ROLIC AG
    公开号:US10442994B2
    公开(公告)日:2019-10-15
    The present invention relates to a photo-alignment composition for the alignment of liquid crystals. Further the present invention relates to the liquid crystal alignment film and coating layer prepared from the said composition and the use to fabricate optical and electrooptical elements and devices.
    本发明涉及一种用于液晶对准的光对准组合物。此外,本发明还涉及由上述组合物制备的液晶配向膜和涂层,以及用于制造光学和电子光学元件和器件的用途。
  • Polyimide solution, heat-resistant non-woven fabric, and method for manufacturing same
    申请人:TORAY INDUSTRIES, INC.
    公开号:US10669377B2
    公开(公告)日:2020-06-02
    The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.
    本发明提供了一种聚酰亚胺溶液,该溶液在获得耐热聚酰亚胺无纺布时不需要在高 温下进行闭环处理,并且在通过电纺丝生产纤维时几乎不受大气湿度的影响,因此在任 何情况下都可以获得直径稳定的纤维。 一种聚酰亚胺溶液,包括:(a) 一种树脂,其中通式(1)所代表的结构单元的含量占树脂总量的 50 摩尔%或以上;(b) 一种溶剂。
  • Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
    申请人:ASAHI KASEI KABUSHIKI KAISHA
    公开号:US10831101B2
    公开(公告)日:2020-11-10
    A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
    一种光敏树脂组合物含有一种树脂和一种化合物,每种树脂和化合物都具有本说明书规定的结构,这种组合物提供的固化薄膜对铜线具有极佳的粘合性。
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