TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3275857A1
公开(公告)日:2018-01-31
The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1),
wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2),
wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); "k" represents 1, 2, or 3; and "n" represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.
本发明提供了一种四羧酸二酯化合物,其通式如下(1)、
其中 X1 代表四价有机基团;R1 代表下式通式(2)所示的基团、
其中虚线代表键;Y1 代表价数为 k+1 的有机基团;Rf 代表具有 1 至 20 个碳原子的直链、支链或环状烷基,或其中部分或全部氢原子被氟原子取代的芳香基团;"k "代表 1、2 或 3;"n "代表 0 或 1。本发明可提供一种四羧酸二酯化合物,该化合物可生成一种可溶于广泛用作组合物溶剂的安全有机溶剂的聚酰亚胺前体聚合物,并可用作负感光树脂组合物的基树脂。