4-tert-Butyl-pyrogallol | 99173-17-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-tert-Butyl-pyrogallol
• 英文别名: 2.3.4-Trihydroxy-1-tert.-butyl-benzol；p-tert.-Butylphenol-dialkohol；4-tert-butylbenzene-1,2,3-triol
• CAS: 99173-17-8
• 化学式: C₁₀H₁₄O₃
• 分子量: 182.219
• InChiKey: ODFOJAXEKVBHQS-UHFFFAOYSA-N

物化性质

• 沸点：
  328.3±37.0 °C(Predicted)
• 密度：
  1.203±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  13
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  叔丁醇 、 邻苯三酚 在 zinc(II) chloride 作用下， 生成 4-tert-Butyl-pyrogallol
  参考文献：
  名称：

  Alkyl substituted pyrogallol

  摘要：

  公开号：

  US02137815A1

文献信息

• SYNTHESIS OF CAROTENOID ANALOGS OR DERIVATIVES WITH IMPROVED ANTIOXIDANT CHARACTERISTICS
  申请人：Foss Bente J.

  公开号：US20090099061A1

  公开（公告）日：2009-04-16

  A method is described for synthesizing and administering carotenoid compounds with improved antioxidant characteristics. In some embodiments, extension or improvement of conjugation may be employed in structural modification of carotenoids. In other embodiments, reduction of ring/chain steric hindrance may improve the lambda max, and hence, the overall antioxidant capability, of particular compounds. In other embodiments, introduction and/or increase in synthetic handles for conjugation may improve the stoichiometric ratios of conjugating moieties to the polyene backbone. The methods may be used to improve natural and/or synthetic compounds for medicinal application in the treatment of disease.

  本文描述了一种合成和给予具有改善抗氧化特性的类胡萝卜素化合物的方法。在某些实施方式中，可以采用共轭的扩展或改进来进行类胡萝卜素的结构修饰。在其他实施方式中，降低环/链位阻可能会提高特定化合物的lambda max，从而提高其整体抗氧化能力。在其他实施方式中，引入和/或增加用于共轭的合成手柄可能会改善共轭基团与多烯骨架的化学计量比。这些方法可用于改善天然和/或合成化合物，以用于治疗疾病的医学应用。
• SOLID CATALYST COMPONENT FOR OLEFIN POLYMERIZATION AND CATALYST
  申请人：Toho Titanium Co., Ltd.

  公开号：EP1260524A1

  公开（公告）日：2002-11-27

  The solid catalyst component for polymerization of olefins comprising (a) a magnesium compound, (b) titanium tetrachloride, (c) a phthalic acid diester or a derivative thereof, and (d1) a hydroxy group-containing hydrocarbon compound having a specific structure or (d2) a mercapto group-containing hydrocarbon compound having a specific structure and the olefin polymerization catalyst can produce olefin polymers in a very high yield, particularly can produce propylene polymers in a very high yield, while retaining high stereoregularity.

  用于烯烃聚合的固体催化剂组分包括：(a) 镁化合物；(b) 四氯化钛；(c) 邻苯二甲酸二酯或其衍生物；(d1) 具有特定结构的含羟基烃化合物或 (d2) 具有特定结构的含巯基烃化合物，该烯烃聚合催化剂能以极高的产率生产烯烃聚合物，特别是能以极高的产率生产丙烯聚合物，同时保持较高的立体规整性。
• Thermally-conductive epoxy resin molded article and method of manufacturing the same
  申请人：Polymatech Co., Ltd.

  公开号：EP1424383A1

  公开（公告）日：2004-06-02

  A thermally-conductive epoxy resin molded article conducting heat generated from electronic components and the like, and a method of manufacturing the same are disclosed. The thermally-conductive epoxy resin molded article according to the present invention is obtained by curing an epoxy resin composition containing an epoxy resin. The epoxy resin contained in the thermally-conductive epoxy resin molded article has the degree of orientation α equal to or larger than 0.5 and smaller than 1.0. The degree of orientation α is determined by the following equation:degree of orientation α = (180 - Δβ)/180 wherein Δβ represents a half-width of a peak in an intensity distribution measured by fixing to a peak scattering angle in an x-ray diffraction measurement, and then changing an azimuth angle from 0 degree to 360 degrees.

  本发明公开了一种可传导电子元件等产生的热量的导热环氧树脂模制件及其制造方法。根据本发明，导热环氧树脂模塑件是通过固化含有环氧树脂的环氧树脂组合物而获得的。导热环氧树脂模塑件所含环氧树脂的取向度 α 等于或大于 0.5，小于 1.0。取向度 α 由下式确定：取向度 α = (180 - Δβ)/180 其中，Δβ 表示通过固定 X 射线衍射测量中的峰值散射角，然后将方位角从 0 度改变到 360 度所测量的强度分布中的峰值半宽。
• Process for etching using sulfur compounds
  申请人：SOLVAY SA

  公开号：EP2540800A1

  公开（公告）日：2013-01-02

  Certain cyclic fluorosubstituted sulfolenes, [1,3,2]-dioxathiepines, sulfolanes and [1,3,2]-dioxathiepanes can be used as etching gases, especially for anisotropic etching in the production of etched items, for example, of semiconductors, e.g. semiconductor memories or semiconductor logic circuits, flat panels, or solar cells. Preferred compounds are hexafluoro-3-sulfolene, (Z)-perfluoro-4,7-dihydro-[1,3,2]-dioxathiepine, hexafluoro-3,4-dihydrosulfolane and 4,4,5,6,7,7-hexafluoro-[1,3,2]-dioxathiepane. The compounds have the especial advantage that they allow the direct etching of photoresist-protected items where the pattern of the photoresist is defined by light of a wavelength of 193 nm, or even "extreme UV light". Nodes with a very narrow gap, e.g. nodes with any gap in the range of 130 nm to 7 nm and beyond, for example, nodes with gaps of 130 nm, 90 nm, 45 or 32 nm and even 17 nm and 7 nm, can be produced.

  某些环状氟代亚砜、[1,3,2]-二氧代硫杂环庚烷、亚砜和[1,3,2]-二氧代硫杂环庚烷可用作蚀刻气体，特别是在生产蚀刻物品（例如半导体存储器或半导体逻辑电路、平板或太阳能电池）时用于各向异性蚀刻。首选化合物为六氟-3-亚砜、(Z)-全氟-4,7-二氢-[1,3,2]-二氧代硫杂环庚烷、六氟-3,4-二氢亚砜和 4,4,5,6,7,7-六氟-[1,3,2]-二氧代硫杂环庚烷。 这些化合物的特别优点是可以直接蚀刻受光刻胶保护的物品，光刻胶的图案是由波长为 193 纳米的光，甚至是 "极紫外光 "确定的。可以生产间隙非常窄的节点，例如间隙在 130 纳米到 7 纳米之间的节点，甚至更大，例如间隙为 130 纳米、90 纳米、45 纳米或 32 纳米，甚至 17 纳米和 7 纳米的节点。
• FILLER COMPOSITION FOR SPACE BETWEEN LAYERS OF THREE-DIMENSIONAL INTEGRATED CIRCUIT, COATING FLUID, AND PROCESS FOR PRODUCING THREE-DIMENSIONAL INTEGRATED CIRCUIT
  申请人：Mitsubishi Chemical Corporation

  公开号：EP2631255A1

  公开（公告）日：2013-08-28

  To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A), or comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a coefficient of thermal conductivity of at least 0.2 W/mK, an inorganic filler (C) having a coefficient of thermal conductivity of at least 2 W/mK, a volume average particle size of at least 0.1 µm and at most 5 µm and a maximum volume particle size of at most 10 µm, and a curing agent (D) and/or a flux (B).

  提供一种层间填料组合物，在半导体器件芯片的三维层压中，与焊料凸块或类似物的粘合同时形成高导热填料层，并在半导体器件芯片之间着地，还提供一种涂布液和一种生产三维集成电路的工艺。 一种用于三维集成电路的层间填充组合物，它包括在 120°C 时熔融粘度不超过 100 Pa-s 的树脂 (A) 和助焊剂 (B)，助焊剂 (B) 的含量至少为每 100 份树脂 (A) 0.1 份（按重量计），至多为 10 份（按重量计），或包括在 120°C 时熔融粘度不超过 100 Pa-s 的树脂 (A) 和导热系数至少为 0.2 W/mK 的树脂 (A)、导热系数至少为 2 W/mK 的无机填料 (C)、体积平均粒径至少为 0.1 微米且最多为 5 微米且最大体积粒径最多为 10 微米的无机填料 (C)，以及固化剂 (D) 和/或助焊剂 (B)。