Poly[oxy(2,6-dimethyl-1,4-phenylene)], I,Ia(2)-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis[I+/--hydro- | 1116572-51-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Poly[oxy(2,6-dimethyl-1,4-phenylene)], I,Ia(2)-[(1-methylethylidene)bis(4,1-phenyleneoxy)]bis[I+/--hydro-
• 英文别名: 4-[4-[2-[4-(4-hydroxy-3,5-dimethylphenoxy)phenyl]propan-2-yl]phenoxy]-2,6-dimethylphenol
• CAS: 1116572-51-0
• 化学式: C₃₁H₃₂O₄
• 分子量: 468.6
• InChiKey: FVHJXAUXZOAWBP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.5
• 重原子数：
  35
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  58.9
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• CURATIVES FOR EPOXY COMPOSITIONS
  申请人：Designer Molecules, Inc.

  公开号：US20130199724A1

  公开（公告）日：2013-08-08

  The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

  本发明提供了环氧和氧杂环烷组合物，其中包括本文所述的新型酰氧基和N-酰基固化剂。使用本发明的固化剂可以得到固化粘合剂组合物，其粘附性显著增强，与使用其他类型固化剂固化的树脂相比，水亲和性降低。此外，本发明的固化剂不会干扰自由基固化，因此适用于混合固化热固性组合物。
• RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF
  申请人：YU Li-Chih

  公开号：US20130075136A1

  公开（公告）日：2013-03-28

  A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.
• COMPOSITES FOR PROTECTING SIGNAL TRANSMITTERS/RECEIVERS
  申请人：SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

  公开号：US20160297941A1

  公开（公告）日：2016-10-13

  Embodiments of the present disclosure are directed to a composition and composite for protecting a transmission/reception device. The composite can include a reinforcing material and a cured epoxy composition impregnating the reinforcing material. The cured epoxy composition can contain reaction constituents including less than 50% stoichiometric amount of an anhydride curing agent to an epoxy resin. The composite can exhibit synergistic improvements in mechanical strength, weatherability, and signal transmission properties.
• US8404764B1
  申请人：——

  公开号：US8404764B1

  公开（公告）日：2013-03-26