The invention provides a composition comprising (A), (B) and (C); where
(A) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 1 or more alkoxysilane, silanol and/or acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000;
(B) a low molecular weight compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 240 to 5,000; and
(C) at least one chelate compound of aluminum, titanium or zirconium.
A method of curing this composition at a temperature not exceeding 100°C is also described.
本发明提供了一种由(A)、(B)和(C)组成的组合物;其中
(A) 高分子量化合物,平均每个分子含有 2 个或 2 个以上羟基和 1 个或 1 个以上烷氧基
硅烷、
硅烷醇和/或酰氧基
硅烷基团,平均分子量为 3,000 至 200,000 ;
(B) 低分子量化合物,平均每分子含有 2 个或更多环氧基团,平均分子量为 240 至 5000;以及
(C) 至少一种铝、
钛或
锆的螯合物。
还描述了在不超过 100°C 的温度下固化这种组合物的方法。