10,10-Bis-(4-hydroxy-phenyl)-9,10-dihydro-anthracen-9-ol | 29474-61-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 蒽
• 英文名称: 10,10-Bis-(4-hydroxy-phenyl)-9,10-dihydro-anthracen-9-ol
• 英文别名: 10,10-bis(4-hydroxyphenyl)-9H-anthracen-9-ol
• CAS: 29474-61-1
• 化学式: C₂₆H₂₀O₃
• 分子量: 380.443
• InChiKey: BJSPESLPQWYQKL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.1
• 重原子数：
  29
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

文献信息

• NOVEL EPOXY RESIN AND EPOXY RESIN COMPOSITION COMPRISING THE SAME
  申请人：Chun Hyun-Aee

  公开号：US20120041102A1

  公开（公告）日：2012-02-16

  The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

  本发明涉及一种具有改进的耐热性、热膨胀性和加工性的新型环氧树脂，以及包含该环氧树脂的热固性树脂组合物。为此，本发明提供了一种化学式1的环氧树脂，其详细描述在说明书中披露，以及包含该环氧树脂的环氧树脂组合物，以及由此形成的包装、基板和晶体管。当含有本发明的具有特定侧基团的环氧树脂和/或具有特定核心结构的环氧树脂的组合物被固化时，填料与环氧树脂形成强化学键，从而最大化填料对环氧树脂的填充效果。此外，具有特定核心结构，固化产品的耐热性和热膨胀性得到了显著改善（CTE降低），并表现出增强的玻璃转移性能、强度和加工性。