The invention provides: a resin as a material of a composition for forming an organic film having high filling and planarizing properties and etching resistance; the composition; and a patterning process using the composition. Provided is a composition for forming an organic film, including:
(I) a resin having a structure shown by a general formula (1) in which a ring structure AR containing an aromatic ring and a spiro structure SP bonded to four of the ARs are alternately repeated in at least a portion of a repeating unit; and
(II) an organic solvent.
本发明提供了:作为用于形成有机薄膜的组合物的材料的
树脂,该组合物具有高填充性和平面化性能以及耐蚀刻性;该组合物;以及使用该组合物的图案化工艺。本发明提供了一种用于形成有机薄膜的组合物,包括
(I) 具有通式 (1) 所示结构的
树脂,其中包含芳香环的环状结构 AR 和与四个 AR 键合的螺状结构
SP 在重复单元的至少一部分中交替重复;以及
(II) 有机溶剂。