The present invention provides co-curable compositions in which an anionically or cationically reactive component, such as an epoxy or episulfide resin component; a free-radical polymerizable component; and a cross linking component, where the cross linking component is reactive with each of the anionically or cationically reactive component and the free radical polymerizable component through functionalization with at least one group reactive through an anionic or cationic mechanism and at least one group reactive through a free radical mechanism. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
本发明提供了共固化组合物,其中包括阴离子或阳离子反应组分,例如环氧或环
硫醚
树脂组分;自由基可聚合组分;以及交联组分,其中交联组分通过至少一种通过阴离子或阳离子机制反应的基团和至少一种通过自由基机制反应的基团进行官能化,与阴离子或阳离子反应组分和自由基可聚合组分反应。本发明还提供了制备这种组合物的方法,将这种组合物应用于基底表面的方法,以及用于连接微电子电路的组件。