4,4'-双(4-氨基-2-三氟甲基苯氧基)二苯砜 | 138322-14-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 4,4'-双(4-氨基-2-三氟甲基苯氧基)二苯砜
• 英文名称: 2,2′-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]sulfone
• 英文别名: 6FBAPS；Bis[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl] sulfone；4-[4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]sulfonylphenoxy]-3-(trifluoromethyl)aniline
• CAS: 138322-14-2
• 化学式: C₂₆H₁₈F₆N₂O₄S
• 分子量: 568.496
• InChiKey: PBCUJIJENFOTDR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.2
• 重原子数：
  39
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  113
• 氢给体数：
  2
• 氢受体数：
  12

反应信息

• 作为产物：
  描述：

  4,4'-bis(4-nitro-2-trifluoromethylphenoxy)diphenyl sulfone 在 hydrazine hydrate 、 palladium on carbon 作用下， 以 乙醇 为溶剂， 生成 4,4'-双(4-氨基-2-三氟甲基苯氧基)二苯砜
  参考文献：
  名称：

  高透明度、低热膨胀系数的高热塑性聚酰胺酰亚胺的合成

  摘要：

  随着注塑光学元件的应用，对热塑性聚酰亚胺（TPI）在透明度和热膨胀系数（CTE）方面提出了更高的要求。衍生自 2,2'-(2,2'-双(三氟甲基)-[1,1'-联苯]-4,4'-二基)双(1,3-) 的两个系列热塑性聚酰胺酰亚胺 (PAI)在室温下制备了二氧异吲哚啉-5-碳酰氯）（CT-TFDB）和具有特定基团的刚性/柔性芳香二胺，它们都表现出中等的玻璃化转变温度（T g s）在251-274°C范围内，优异的尺寸稳定性，CTE 值为 17–34 ppm/K，高透光率 ( T 450nm  ≥ 59%) 和良好的热塑性，具有 -d log E' / dT值为 0.08–0.34。其中，PAI-2a表现出最好的综合性能，特别是高热塑性（-d log E ' / dT  = 0.34）、低CTE（28 ppm/K）和高透光率（T 450nm  = 84%），为光学领域热塑性PAI材料的研究提供了新策略。

  DOI：

  10.1016/j.polymer.2023.126093

文献信息

• Fluorinated bis(phthalic anhydride) and method for producing the same
  申请人：Masuda Go

  公开号：US20050020839A1

  公开（公告）日：2005-01-27

  It is an object of the present invention to provide fluorinated bis(phthalic anhydride) which has less coloration and higher solubility in comparison with conventional compounds, and a method for producing the same. Further, it is also an object of the present invention to provide a method for producing a fluorinated bis(phthalonitrile) compound, which is an intermediate raw material compound of the method for producing the fluorinated bis(phthalic anhydride), and a polyamic acid and a polyimide, which are produced from the fluorinated bis(phthalic anhydride). A fluorinated bis(phthalic anhydride) of the present invention is the fluorinated bis(phthalic anhydride) represented by the following formula (I 1 ), wherein its specific surface area is 3.0 m 2 /g or larger. It is also characterized in that its molar absorption coefficient is 0.6 L/mol·cm or less at a wavelength of 360 nm. [wherein, m and n independently represent integers of 1 to 3, and Z 1 represents a single bond group or a bivalent organic group.]

  本发明的目的是提供具有比传统化合物更少着色和更高溶解性的氟化双(邻苯二甲酸酐)以及其生产方法。此外，本发明还旨在提供一种用于生产氟化双(邻苯二腈)化合物的方法，该化合物是生产氟化双(邻苯二甲酸酐)的中间原料化合物，并且提供由氟化双(邻苯二甲酸酐)生产的聚酰胺酸和聚酰亚胺的方法。本发明的氟化双(邻苯二甲酸酐)是由以下式(I1)表示的氟化双(邻苯二甲酸酐)，其中其比表面积为3.0 m2/g或更大。其特征在于，在360 nm波长处，其摩尔吸光系数不超过0.6 L/mol·cm。【其中，m和n独立表示1到3的整数，Z1表示单键基团或二价有机基团。】
• Low thermal expansion resin material for a wiring insulating film.
  申请人：HITACHI, LTD.

  公开号：EP0133533A2

  公开（公告）日：1985-02-27

  A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

  一种由聚酰亚胺组成的树脂材料，其化学结构单元为至少一个芳香环，该芳香环可绕其分子轴旋转，但在另一个方向上没有柔韧性，所述聚酰亚胺至少在单轴方向上定向，具有较低的热膨胀系数，并可与无机材料塑合成一体，形成复合形状的物品。
• FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION
  申请人：NIPPON STEEL CHEMICAL CO., LTD.

  公开号：EP0297139A1

  公开（公告）日：1989-01-04

  The flexible print board contains as an insulating material a less heat-swelling resin having structural units represented by general formula (I), wherein Ar1 represents a tetravalent aromatic group, and Ar2 represents a compound of formula (II), (III) or (IV). wherein R1 to R8 may be the same or different and each represents a lower alkyl group, a lower alkoxy group or a halogen atom, and n1 to n8 each represents an integer of 0 to 4. This flexible board is produced by directly applying a solution of polyamidoimide precursor on a conductive substance and conducting imidation to form the insulating material of the less heat-swelling resin of the above- described general formula (I). The flexible printed circuit board undergoes less curling and has excellent adhesiveness, bending resistance, and dimensional stability.

  柔性印制板含有一种热膨胀性较低的树脂作为绝缘材料，该树脂具有通式（I）所代表的结构单元，其中 Ar1 代表四价芳香族基团，Ar2 代表式（II）、（III）或（IV）化合物。 这种柔性电路板是通过在导电物质上直接涂敷聚酰胺酰亚胺前体溶液并进行酰亚胺化，形成上述通式（I）的热膨胀性较小的树脂绝缘材料而制成的。这种柔性印刷电路板的卷曲现象较少，并且具有出色的粘合性、抗弯曲性和尺寸稳定性。
• A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0355927A2

  公开（公告）日：1990-02-28

  Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.

  本发明公开了一种聚酰亚胺前体，它由特定的聚酰胺酸酯、聚酰胺或聚酰胺酸盐结构组成，由四羧酸化合物和二胺化合物衍生而成，可通过加热转化为具有低热应力的聚酰亚胺。将这种具有乙烯双键的新型聚酰亚胺前体的特定形式与光聚合引发剂混合，可以得到一种极佳的光聚合组合物。不仅是这种前体，通过光聚合反应得到的交联前体也可以通过加热转化为聚酰亚胺树脂，这种树脂具有低热膨胀系数、高耐热性、优异的机械性能以及与基材的良好粘合性。因此，这种前体和可光聚合组合物可以很好地用于电气和电子元件的生产。
• Process for producing metal-polyimide composite article
  申请人：HITACHI, LTD.

  公开号：EP0361461A2

  公开（公告）日：1990-04-04

  The present invention provides a process for producing a metal (2)-polyimide (3) composite material such as a wiring board. In production thereof, deterioration of polyamide film (3) due to oxidation during imidization of a polyimide precursor in contact with metal (2) such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

  本发明提供了一种生产金属（2）-聚酰亚胺（3）复合材料（如线路板）的工艺。在生产过程中，可以防止聚酰亚胺前体在与铜或银等金属（2）接触的亚胺化过程中因氧化而导致聚酰胺薄膜（3）变质。本发明的特点是使用具有被掩蔽的酸性官能团的聚酰亚胺前体。聚酰胺前体的例子有聚酰胺酸环氧加合物、氨基聚酰胺酸、硅烷化聚酰胺酸等。