Dinaphthalen-1-yl benzene-1,3-dicarboxylate | 477773-59-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Dinaphthalen-1-yl benzene-1,3-dicarboxylate
• CAS: 477773-59-4
• 化学式: C₂₈H₁₈O₄
• 分子量: 418.4
• InChiKey: BTGKSZSRCPEZLG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.2
• 重原子数：
  32
• 可旋转键数：
  6
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  52.6
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• RESIN COMPOSITION, CURED RESIN, CURED RESIN SHEET, LAMINATE, PREPREG, ELECTRONIC PART, AND MULTILAYER SUBSTRATE
  申请人：TDK Corporation

  公开号：EP1580235A1

  公开（公告）日：2005-09-28

  The invention provides electronic parts which comprise a composite dielectric layer composed of an organic insulating material and a dielectric ceramic powder having a larger relative dielectric constant than the organic insulating material, and which also comprise conductive element sections forming inductor elements, etc., wherein the organic insulating material comprises a cured resin obtained by curing reaction of an epoxy resin with an active ester compound obtained by reaction between a compound with two or more carboxyl groups and a compound with a phenolic hydroxyl group. The dielectric ceramic powders of the described electronic parts have larger relative dielectric constants than the organic insulating materials, and the organic insulating materials have low dielectric loss tangents. It is possible to adequately reduce time-dependent dielectric constant changes in the high-frequency range of 100 MHz and above even with prolonged use at high temperatures of 100°C and higher, while it is also possible to satisfactorily prevent deformation and other damage to the electronic parts during their handling.

  本发明提供了由有机绝缘材料和介电陶瓷粉构成的复合介电层（其相对介电常数比有机绝缘材料大）组成的电子零件，该电子零件还包括构成电感器元件等的导电元件部分，其中有机绝缘材料包括通过环氧树脂与活性酯化合物的固化反应得到的固化树脂，活性酯化合物是由具有两个或两个以上羧基的化合物与具有酚羟基的化合物反应得到的。所述电子零件的介电陶瓷粉的相对介电常数比有机绝缘材料大，而有机绝缘材料的介电损耗正切值低。在 100 兆赫及以上的高频范围内，即使在 100 摄氏度及以上的高温下长期使用，也能充分降低随时间变化的介电常数变化，同时还能令人满意地防止电子部件在处理过程中发生变形和其他损坏。
• RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2604639A2

  公开（公告）日：2013-06-19

  By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

  通过生产含有以下成分的树脂组合物：(A) 在一个分子中含有两个或两个以上环氧基团并含有己二醇结构的环氧树脂；(B) 含有紫外线活性酯基的化合物；(C) 环氧树脂固化促进剂，即使在绝缘树脂层表面的不规则形状较小的状态下，也能轻松显示出与配线导体的高粘合力。
• Active ester resin and cured product thereof
  申请人：DIC Corporation

  公开号：US10741464B2

  公开（公告）日：2020-08-11

  Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (α); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.

  本发明提供了一种能够具有低固化收缩率并形成具有低介电损耗正切的固化物的活性酯树脂、一种包括该酯树脂的可固化树脂组合物、一种该树脂组合物的固化物、一种印刷电路板和一种半导体封装材料。活性酯树脂包括以下主要原料的反应产物：含酚羟基化合物（A）；聚萘酚树脂（B），其分子结构中萘酚化合物（b）分子与芳香环或环状结构分子（α）相连；以及芳香族聚羧酸或其酸卤化物（C）。此外，还提供了包括酯树脂的可固化树脂组合物、树脂组合物的固化产物、印刷线路板和半导体封装材料。
• Resin composition, sheet-shaped laminated material, printed wiring board, and semiconductor device
  申请人：AJINOMOTO CO., INC.

  公开号：US10711088B2

  公开（公告）日：2020-07-14

  Provided is a resin composition that can provide a cured product of low dielectric tangent, high mechanical strength, and high adhesiveness. The resin composition contains (A) a resin having a thermosetting functional group FA, (B) a resin having a radical polymerizable functional group FB, and (C) a resin having a functional group FA′ reacting with the thermosetting functional group FA and a functional group FB′ reacting with the radical polymerizable functional group FB. A number na of the functional group FA′ of the component (C) when the number of the thermosetting functional group FA of the component (A) is defined as 1 and a number nb of the functional group FB′ of the component (C) when the number of the radical polymerizable functional group FB of the component (B) is defined as 1 satisfy 0.01≤na≤200 and 0.01≤nb≤400, respectively.

  本发明提供了一种树脂组合物，它能提供低介电常数、高机械强度和高粘合性的固化产品。该树脂组合物包含（A）具有热固性官能团 FA 的树脂，（B）具有可自由基聚合的官能团 FB 的树脂，以及（C）具有与热固性官能团 FA 反应的官能团 FA′和与可自由基聚合的官能团 FB 反应的官能团 FB′的树脂。当组分(A)的热固性官能团 FA 的数目定义为 1 时，组分(C)的官能团 FA′ 的数目 na；当组分(B)的可自由基聚合的官能团 FB 的数目定义为 1 时，组分(C)的官能团 FB′ 的数目 nb 分别满足 0.01≤na≤200 和 0.01≤nb≤400。
• Active ester composition and cured product thereof
  申请人：DIC Corporation

  公开号：US10800914B2

  公开（公告）日：2020-10-13

  Provided are an active ester composition capable of exhibiting high curability and forming a cured product with various excellent properties such as low dielectric properties, a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition. The active ester composition includes, as essential components, an active ester compound (A) and a phenolic hydroxyl group-containing compound (B), in which the active ester compound (A) is an esterification product of a compound having one phenolic hydroxyl group in the molecular structure (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2). Also provided are a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition.

  本发明提供了一种活性酯组合物，该活性酯组合物能够表现出高固化性，并形成具有各种优异性能（例如低介电性能）的固化物、其固化物，以及使用该活性酯组合物获得的半导体封装材料和印刷线路板。活性酯组合物包括作为基本成分的活性酯化合物（A）和含酚羟基化合物（B），其中活性酯化合物（A）是分子结构中含有一个酚羟基的化合物（a1）和芳香族多羧酸或其酸卤化物（a2）的酯化产物。此外，还提供了其固化产品，以及使用该活性酯组合物获得的半导体封装材料和印刷线路板。