Bis-(4-p-tolyloxy-phenyl)-methanone | 19283-68-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Bis-(4-p-tolyloxy-phenyl)-methanone
• 英文别名: Bis[4-(4-methylphenoxy)phenyl]methanone
• CAS: 19283-68-2
• 化学式: C₂₇H₂₂O₃
• 分子量: 394.47
• InChiKey: OEAKLENMZGIVFR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.1
• 重原子数：
  30
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.07
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• BASE GENERATOR
  申请人：Eternal Chemical Co., Ltd.

  公开号：US20130172569A1

  公开（公告）日：2013-07-04

  The present invention provides a base generator having the structure of formula (1): wherein R 1 , R 2 , R 3 , R 4 , R 5 , and Y circle around (−)} are defined as in the specification. The base generator of the present invention can be used for imidization of a polyimide precursor, promoting crosslinking of epoxy monomers, or crosslinking of polyurethane or polyurea.

  本发明提供了一种具有公式（1）结构的碱发生器： 其中R1、R2、R3、R4、R5和Ycircle around (−)}如说明书中所定义。本发明的碱发生器可用于聚酰亚胺前体的酰亚胺化，促进环氧单体交联，或聚氨酯或聚脲的交联。
• OLIGOMERS WITH DI-PHENYLETHYNYL ENDCAPS
  申请人：Tsotsis Thomas K.

  公开号：US20100204412A1

  公开（公告）日：2010-08-12

  An oligomer having di-phenylethynyl endcaps is disclosed. The capped oligomer has the formula: D-A-D wherein D is a di-phenylethynyl endcap; and A is an oligomer selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone.

  公开了一种具有二苯乙炔端基的寡聚物。带端基的寡聚物的化学式为：D-A-D，其中D是二苯乙炔端基；A是从亚砜酸酐、醚、醚砜、酰胺、酰亚胺、酯、酯砜、醚亚胺、酰胺亚胺、噁唑、噁唑砜、噻唑、噻唑砜、咪唑和咪唑砜组成的寡聚物。
• POLYACETYLINIC OLIGOMERS
  申请人：Tsotsis Thomas K.

  公开号：US20100204485A1

  公开（公告）日：2010-08-12

  Polyacetylinic oligomers suitable for high-temperature polymer-matrix composites are provided. The polyacetylinic oligomers have the formula: D-A-D wherein D is an endcap including at least one crosslinking functionality; and A is backbone selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone. At least one ethynyl functional group, however, is incorporated into the backbone such that crosslinking is not only realized at the endcaps but also at the ethynyl groups within the backbone of the oligomer itself.

  提供适用于高温聚合物基复合材料的聚乙炔寡聚体。该聚乙炔寡聚体具有以下公式：D-A-D，其中D是至少包括一个交联功能的末端盖；而A是从亚砜酰胺、醚、醚砜、酰胺、亚酰胺、酯、酯砜、醚亚酰胺、酰胺亚酰胺、噁唑、噁唑砜、噻唑、噻唑砜、咪唑和咪唑砜组成的主链。但是，至少一个乙炔官能团被并入到主链中，使得交联不仅在末端盖处实现，而且在寡聚体本身的主链中的乙炔基团处也能实现交联。
• NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
  申请人：Asahi Kasei Kabushiki Kaisha

  公开号：EP4006073A1

  公开（公告）日：2022-06-01

  To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

  提供一种负感光树脂组合物，该组合物即使在聚焦深度发生偏移时也能表现出令人满意的分辨率，并且与模具树脂具有令人满意的粘附性，并表现出较低的介电常数；提供一种使用该感光树脂组合物生产聚酰亚胺的方法；提供一种生产固化浮雕图案的方法；以及提供一种包括固化浮雕图案的半导体器件。 本发明公开了一种阴性光敏树脂组合物，该组合物包括具有通式(A1)表示的结构的聚酰亚胺前体、(B)光聚合引发剂和(C)溶剂。
• Polyimides, coating composition formed therefrom and use thereof
  申请人：Eternal Materials Co., Ltd.

  公开号：US10280334B2

  公开（公告）日：2019-05-07

  A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.

  提供了一种聚酰亚胺（PI），其两端各有两个-COOH封端基团。本发明还提供了一种涂层组合物，其中包含 PI 和一种具有 2 至 6 个能与 -COOH 反应的官能团的硬化剂。由本发明的涂层组合物形成的 PI 涂层和 PI 薄膜具有优异的耐化学性和热膨胀系数（CTE），因此适用于制造有源/无源器件的保护材料、光学材料、触摸面板、铜箔基板、软挠性电子材料或集成电路元件，或玻璃薄膜触摸面板的薄膜基板。