Poly(oxy-1,4-butanediyl), I+/--[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)benzoyl]-I-[[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)benzoyl]oxy]- | 114539-68-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Poly(oxy-1,4-butanediyl), I+/--[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)benzoyl]-I-[[4-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)benzoyl]oxy]-
• 英文别名: 4-[4-(2,5-dioxopyrrol-1-yl)benzoyl]oxybutyl 4-(2,5-dioxopyrrol-1-yl)benzoate
• CAS: 114539-68-3
• 化学式: C₂₆H₂₀N₂O₈
• 分子量: 488.4
• InChiKey: SCBQDWZGPZMICZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  36
• 可旋转键数：
  11
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.15
• 拓扑面积：
  127
• 氢给体数：
  0
• 氢受体数：
  8

文献信息

• THERMALLY REVERSIBLE HOT MELT ADHESIVE COMPOSITION CONTAINING MULTIFUNCTIONAL DIENE AND DIENOPHILE COMPOUNDS
  申请人：Herr Donald

  公开号：US20120082840A1

  公开（公告）日：2012-04-05

  The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.
• RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL AND PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：US20160125971A1

  公开（公告）日：2016-05-05

  A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).
• Photopatternable Materials and Related Electronic Devices and Methods
  申请人：Polyera Corporation

  公开号：US20160190337A1

  公开（公告）日：2016-06-30

  The present polymeric materials can be patterned with relatively low photo-exposure energies and are thermally stable, mechanically robust, resist water penetration, and show good adhesion to metal oxides, metals, metal alloys, as well as organic materials. In addition, these polymeric materials can be solution-processed (e.g., by spin-coating), and can exhibit good chemical (e.g., solvent and etchant) resistance in the cured form.
• US8734939B2
  申请人：——

  公开号：US8734939B2

  公开（公告）日：2014-05-27
• US9704997B2
  申请人：——

  公开号：US9704997B2

  公开（公告）日：2017-07-11