Controllable radiation curable photoiniferter prepared adhesives for attachment of microelectronic devices and a method of attaching microelectronic devices therewith
申请人:MINNESOTA MINING AND MANUFACTURING COMPANY
公开号:EP0449619A2
公开(公告)日:1991-10-02
The present invention provides controllably curable photoiniferter containing adhesive compositions which are suitable for the mounting of microelectronic devices such as flip chips onto transparent wiring boards, a method of making the adhesive compositions, and a method of using the adhesive compositions in order to bond microelectronic devices to transparent wiring boards by intermittent exposure of the adhesive composition to a radiant energy source. The adhesive compositions can be cured in a stepwise fashion by intermittent controlled exposure to a source of radiation thus providing exactly the amount of cure and hardening desired.
本发明提供了适用于将微电子器件(如倒装芯片)安装到透明线路板上的可控固化的含光增塑剂的粘合剂组合物、粘合剂组合物的制造方法以及使用粘合剂组合物的方法,以便通过将粘合剂组合物间歇地暴露于辐射能量源来将微电子器件粘合到透明线路板上。粘合剂组合物可以通过间歇性受控暴露于辐射源而逐步固化,从而精确地提供所需的固化和硬化量。