The present invention is in the field of processes for the generation of thin inorganic films on substrates, in particular atomic layer deposition processes. The present invention relates to a process comprising bringing a compound of general formula (I) into the gaseous or aerosol state and depositing the compound of general formula (I) from the gaseous or aerosol state onto a solid substrate, wherein M is Mn, Ni or Co, X is a ligand which coordinates M, n is 0, 1, or 2, R1, R2 are an alkyl group, an alkenyl group, an aryl group or a silyl group, m is 1, 2, or 3, R3, R4, and R5 are an alkyl group, an alkenyl group, an aryl group, an alkoxy group, or an aryloxy group, and p is 1, 2 or 3.
本发明属于在基底上生成无机薄膜的工艺领域,特别是原子层沉积工艺。本发明涉及一种工艺,包括将通式(I)化合物带入气态或气溶胶态,并将通式(I)化合物从气态或气溶胶态沉积到固体基底上,其中 M 是 Mn、Ni 或 Co、X是配位 M 的
配体,n 是 0、1 或 2,R1、R2 是烷基、烯基、芳基或
硅基,m 是 1、2 或 3,R3、R4 和 R5 是烷基、烯基、芳基、烷氧基或芳氧基,p 是 1、2 或 3。