4,4'-isophthaloyldi-o-benzenedimethanoic anhydride | 23602-88-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-isophthaloyldi-o-benzenedimethanoic anhydride
• 英文别名: 4,4'-isophthaloyl-diphthalic anhydride；5-[3-(1,3-Dioxo-2-benzofuran-5-carbonyl)benzoyl]-2-benzofuran-1,3-dione
• CAS: 23602-88-2
• 化学式: C₂₄H₁₀O₈
• 分子量: 426.339
• InChiKey: JFFCWTGJNGARJD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  32
• 可旋转键数：
  4
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  121
• 氢给体数：
  0
• 氢受体数：
  8

文献信息

• Polyimides and polyamic acids
  申请人：——

  公开号：US20020182536A1

  公开（公告）日：2002-12-05

  A polyimide having a repeating unit of the general formula (I) and a polyamic acid having a repeating unit of the formula (IV): 1 (wherein, R 1 and R 2 represent H or a C1 to C20 alkyl group, and Z represents a condensed polycyclic aromatic group or an group of the following formulae: 2 Herein, X represents —CO— or —C(═N 2 )—, Y represents a direct bond, —CH 2 —, —O—, —SO 2 —, —S—, —CO— or —C(═N 2 )—, and W represents a direct bond, —CH 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, —S—, —SO—, —SO 2 — or —O—. b, m and n are 0 or 1; r is a C1 to 4 alkyl group, halogen group or phenyl group; a is 0 or 1 to 3.).

  具有通式(I)重复单元的聚酰亚胺和具有通式(IV)重复单元的聚酰胺酸：1（其中，R1和R2代表H或C1至C20烷基，Z代表缩聚的多环芳族基或以下式的基团：2，其中，X代表—CO—或—C(═N2)—，Y代表直接键，—CH2—，—O—，—SO2—，—S—，—CO—或—C(═N2)—，W代表直接键，— —，—C(CH3)2—，—C(CF3)2—，—S—，—SO—，—SO2或—O—。b，m和n为0或1；r为C1至4烷基，卤素基或苯基；a为0或1至3。）
• MEDICAL FILM AND METHOD FOR PRODUCING SAME, MEDICAL COATING COMPOSITION, MEDICAL DEVICE AND METHOD FOR PRODUCING SAME
  申请人：Mitsui Chemicals, Inc.

  公开号：EP3489285A1

  公开（公告）日：2019-05-29

  The purpose of the present invention is to provide a medical film having excellent transparency, heat resistance, and solvent resistance. This medical film is a medical film including a heat-resistant resin having a glass transition temperature measured by thermomechanical analysis TMA of 190°C or higher wherein the medical film has a total light transmittance of 80% or higher at a thickness of 10 µm and a b* value in the L*a*b* color system of 10 or lower.

  本发明的目的是提供一种具有优异透明度、耐热性和耐溶剂性的医用薄膜。这种医用薄膜是一种医用薄膜，包括一种耐热树脂，通过热机械分析 TMA 测得其玻璃化转变温度为 190°C 或更高，其中医用薄膜在厚度为 10 µm 时的总透光率为 80% 或更高，在 L*a*b* 颜色系统中的 b* 值为 10 或更低。
• Block polyimide, block polyamide acid imide and use thereof
  申请人：MITSUI CHEMICALS, INC.

  公开号：US10351673B2

  公开（公告）日：2019-07-16

  Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).

  本发明提供了一种在碱性水溶液中具有适当溶解度的嵌段聚酰胺酸亚胺，以及使用该嵌段聚酰胺酸亚胺获得的具有高透明度和低线性热膨胀系数（低 CTE）的嵌段聚酰亚胺。嵌段聚酰亚胺包括由定义式 (1A) 所代表的重复结构单元构成的嵌段和由定义式 (1B) 所代表的重复结构单元构成的嵌段。
• Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same
  申请人：Mitsui Chemicals, Inc.

  公开号：US10988647B2

  公开（公告）日：2021-04-27

  The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.

  本发明的目的是提供一种半导体衬底制造方法，该方法可防止被研磨的半导体晶片脱落，并可防止获得的半导体衬底开裂或崩裂。为了解决上述问题，该半导体衬底制造方法包括：在支撑材料上形成聚酰亚胺层的聚酰亚胺层形成步骤；将支撑材料和半导体晶片相互粘贴并在其间设置聚酰亚胺层的晶片粘贴步骤；研磨半导体晶片的晶片研磨步骤；从聚酰亚胺层上剥离支撑材料的支撑材料剥离步骤；以及从半导体晶片上剥离聚酰亚胺层的聚酰亚胺层剥离步骤。聚酰亚胺层包括聚酰亚胺，聚酰亚胺包括二苯甲酮骨架和脂肪族结构，其中胺当量重量为 4000 至 20000。
• Binder composition for secondary battery
  申请人：NEC CORPORATION

  公开号：US11018341B2

  公开（公告）日：2021-05-25

  A purpose of the present invention is to provide a binder composition for a secondary battery which can impart excellent battery characteristics, even when the heat treatment temperature is low. The binder composition for a secondary battery according to the present invention is characterized by comprising a polyamic acid comprising a repeating unit represented by chemical formula (1) and an aromatic compound comprising an electron donating group and an organic acid group, wherein A is a tetravalent group obtained by removing acid anhydride groups from a tetracarboxylic dianhydride, B is a divalent group obtained by removing amino groups from a diamine, and at least one of A and B is an aliphatic group.

  本发明的目的是提供一种用于二次电池的粘结剂组合物，该组合物即使在热处理温度较低的情况下也能提供优异的电池特性。根据本发明的二次电池粘结剂组合物，其特征在于包含一种由化学式（1）代表的重复单元组成的聚酰胺酸和一种由电子捐赠基团和有机酸基团组成的芳香族化合物、 其中 A 是通过从四羧酸二酐中去除酸酐基团而得到的四价基团，B 是通过从二胺中去除氨基而得到的二价基团，A 和 B 中至少有一个是脂肪族基团。