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N.N'-Sulfinyl-bis(diphenylamin) | 18810-67-8

中文名称
——
中文别名
——
英文名称
N.N'-Sulfinyl-bis(diphenylamin)
英文别名
Bis-diphenylaminosulfoxid;N-diphenylsulfinamoyl-N-phenylaniline
N.N'-Sulfinyl-bis(diphenylamin)化学式
CAS
18810-67-8
化学式
C24H20N2OS
mdl
——
分子量
384.502
InChiKey
GSTKFTRMOIPPCA-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    6.7
  • 重原子数:
    28
  • 可旋转键数:
    6
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    42.8
  • 氢给体数:
    0
  • 氢受体数:
    4

文献信息

  • Colorless Transparent Polyimide Composite Film and Method for Producing Same
    申请人:Makinoshima Takashi
    公开号:US20080020217A1
    公开(公告)日:2008-01-24
    The present invention provides a colorless, transparent polyimide composite film containing a polyimide (A) having a specific repeating unit, and an organic-treated layered silicate (B) obtained through treatment with an organic onium ion having a specific structure such that the organic-treated layered silicate (B) is dispersed in the polyimide (A); and as well a method for producing a colorless, transparent polyimide composite film, the method including forming a film-form mixture through extrusion or application, onto a support, of a three-component liquid mixture containing the polyimide (A), the organic-treated layered silicate (B), and an organic solvent (C) having a specific SP value; and subsequently removing the organic solvent (C) from the film-form mixture. The polyimide composite film of the present invention is a colorless, transparent film containing the polyimide (A) and the organic-treated layered silicate (B) which is very uniformly dispersed in the polyimide, exhibiting excellent heat resistance and mechanical properties, and exhibiting flexibility.
    本发明提供了一种无色透明的聚酰亚胺复合膜,其中包含具有特定重复单元的聚酰亚胺(A)和经有机阳离子处理的具有特定结构的有机处理层状硅酸盐(B),使得经有机处理的层状硅酸盐(B)分散在聚酰亚胺(A)中;以及一种生产无色透明聚酰亚胺复合膜的方法,该方法包括通过挤出或应用形成膜形混合物,将聚酰亚胺(A)、经有机处理的层状硅酸盐(B)和具有特定SP值的有机溶剂(C)的三组分液体混合物涂覆到支撑物上,并随后从膜形混合物中去除有机溶剂(C)。本发明的聚酰亚胺复合膜是一种无色透明的膜,其中包含聚酰亚胺(A)和经有机处理的层状硅酸盐(B),后者在聚酰亚胺中非常均匀地分散,具有优异的耐热性和机械性能,同时还具有柔韧性。
  • ADHESIVE AID COMPOSITION
    申请人:NIPPON KAYAKU KABUSHIKI KAISHA
    公开号:EP1666556A1
    公开(公告)日:2006-06-07
    The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.
    本发明提供了一种助粘剂组合物,该组合物对聚酰亚胺薄膜具有极佳的粘合强度,且不会降低机械性能,可用于电气材料领域。本发明的一种助粘剂组合物含有一种含羟基的聚酰胺和一种溶剂作为主要成分。含羟基的聚酰胺最好具有由式(1)表示的部分: (其中 R1 代表二价芳香族基团,n 代表取代基的平均数目,为 1 至 4 的正数)。本发明的助粘剂组合物适用于粘合聚酰亚胺薄膜。
  • Thermosetting resin composition and cured product of the same
    申请人:DIC Corporation
    公开号:EP2540759A2
    公开(公告)日:2013-01-02
    A thermosetting resin composition comprising a polyimide resin (A) and a boron compound (B) represented by general formula (b3) below, wherein the polyimide resin (A) is a polyimide resin having a divalent structural unit represented by general formula (a1) below in the formula (b3), R3's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; and Z represents a nitrogen-containing heterocyclic compound.
    一种热固性树脂组合物,由聚酰亚胺树脂 (A) 和化合物 (B) 组成,如下文通式 (b3) 所示,其中聚酰亚胺树脂 (A) 是具有如下文通式 (a1) 所示二价结构单元的聚酰亚胺树脂 在式 (b3) 中,R3 各自独立地代表氢原子、具有 1 至 4 个碳原子的烷基或具有 1 至 4 个碳原子的烷氧基;以及 Z 代表含氮杂环化合物
  • Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same
    申请人:Hitachi Chemical Company, LTD.
    公开号:US10544305B2
    公开(公告)日:2020-01-28
    Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
    本文提供了一种热固性树脂组合物,其中包含聚酰亚胺化合物(A),其结构单元来源于马来酰亚胺化合物(a1),马来酰亚胺化合物(a1)至少有两个 N-取代马来酰亚胺基团,结构单元来源于二胺化合物(a2);改性聚丁二烯(B);以及无机填料(C)。
  • Resin compositions comprising sorbic esters
    申请人:Elantas GmbH
    公开号:US10930409B2
    公开(公告)日:2021-02-23
    Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B; characterized in that a bisphenol F diglycidyl ether or an epoxy novolac is used as epoxy compound a1) in component A.
    树脂组合物,包括 a) a1) 具有至少 2 个环氧基团的一种或多种环氧化合物与 a2) 山梨酸的反应产物 A 组分;b) 含乙烯基的溶剂 B 组分;其特征在于 A 组分中的环氧化合物 a1) 使用双 F 二缩水甘油醚或环氧醛。
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