2,5-dimethylisophthalic acid | 4919-45-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,5-dimethylisophthalic acid
• 英文别名: 2,5-Dimethylbenzene-1,3-dicarboxylic acid
• CAS: 4919-45-3
• 化学式: C₁₀H₁₀O₄
• 分子量: 194.187
• InChiKey: SZTSAWSAXHICME-UHFFFAOYSA-N

物化性质

• 熔点：
  >320 °C
• 沸点：
  402.2±33.0 °C(Predicted)
• 密度：
  1.320±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  14
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  74.6
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  2,5-dimethylisophthalic acid 在 硫酸 、 过氧化苯甲酰 N-溴代丁二酰亚胺(NBS) 作用下， 以 四氯化碳 为溶剂， 反应 26.0h， 生成 2,6-bis(ethoxycarbonyl)-1,4-bis(bromomethyl)benzene
  参考文献：
  名称：

  Photodimerization of benzenes in strained dihetera[3.3]metacyclophanes

  摘要：

  DOI：

  10.1016/s0040-4020(01)87590-6
• 作为产物：
  描述：

  2,6-二溴-1,4-二甲基苯 在 氢氧化钾 作用下， 以 乙二醇甲醚 、 水 为溶剂， 反应 40.0h， 生成 2,5-dimethylisophthalic acid
  参考文献：
  名称：

  Photodimerization of benzenes in strained dihetera[3.3]metacyclophanes

  摘要：

  DOI：

  10.1016/s0040-4020(01)87590-6

文献信息

• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• COMPOUND, POLYMER, PATTERN FORMING MATERIAL, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
  申请人：Kioxia Corporation

  公开号：US20220091510A1

  公开（公告）日：2022-03-24

  A pattern forming material used for forming an organic film on a film to be processed of a substrate having the film to be processed, the organic film being patterned and then impregnated with a metallic compound to form a composite film which is used as a mask pattern when processing the film to be processed, the pattern forming material contains a polymer including a monomer unit represented by the following general formula (3), where, R 1 is H or CH 3 , R 2 is a C 2-14 hydrocarbon group, Q is a C 1-20 hydrocarbon group, or an organic group containing an oxygen atom, a nitrogen atom, or a sulfur atom between carbon-carbon atoms or at a bond terminal of a C 1-20 hydrocarbon group, and X and Y are independently a hydrogen atom or a C 1-4 hydrocarbon group, at least one of them being the C 1-4 hydrocarbon group.

  一种用于在待处理底片的薄膜上形成有机膜的图案形成材料，该有机膜经过图案化处理，然后浸渍金属化合物以形成复合膜，该复合膜在处理待处理薄膜时用作掩膜图案。该图案形成材料包含聚合物，其中包括由下式（3）表示的单体单元，其中R1为H或CH3，R2为C2-14烃基，Q为C1-20烃基或含有氧原子、氮原子或硫原子的有机基，在碳-碳原子之间或C1-20烃基的键端之间，X和Y分别为氢原子或C1-4烃基，其中至少一个为C1-4烃基。
• Process for the production of trimellitic acid and process for the production of trimellitic acid anhydride
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP0896960A2

  公开（公告）日：1999-02-17

  A process for the production of trimellitic acid, which process comprises oxidizing a dialkyl aromatic aldehyde and/or an oxide thereof at from 180 to 240°C with an oxygen-containing gas in a lower aliphatic carboxylic acid solvent in the presence of a catalyst containing a heavy metal and bromine wherein: (a) the solvent has a water content of from 5 to 70% by weight; and/or (b) the catalyst is a bromine manganese based catalyst containing zirconium and/or cerium, and a process for the production of high quality trimellitic acid anhydride from trimellitic acid.

  一种偏苯三酸的生产工艺，该工艺包括在含有重金属和溴的催化剂存在下，在180至240℃的温度下，在低级脂肪族羧酸溶剂中用含氧气体氧化二烷基芳香醛和/或其氧化物，其中： (a) 溶剂的含水量为 5%至 70%（按重量计）；和/或 (b) 催化剂为含锆和/或铈的溴锰基催化剂，以及从偏苯三酸生产高质量偏苯三酸酐的工艺。
• COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF
  申请人：Nippon Soda Co., Ltd.

  公开号：EP2489689A1

  公开（公告）日：2012-08-22

  An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): (A) an epoxy resin; (B) a clathrate compound of a carboxylic acid derivative represented by formula (I):         R(COOH)n     (I); and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).

  本发明的目的是提供一种用于形成固化环氧树脂的组合物，其中该组合物可以在低温下抑制固化反应，从而提高单包稳定性，还可以进行加热处理，从而有效地固化树脂。本发明提供了一种用于形成固化环氧树脂的组合物，该组合物包括以下组分（A）、（B）和（C）： (A) 环氧树脂； (B) 由式(I)代表的羧酸衍生物的凝块化合物： R(COOH)n (I)； 和式 (II) 所代表的咪唑化合物；以及 (C) 式 (III) 所代表的四联酚型化合物。
• CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME
  申请人：Nippon Soda Co., Ltd.

  公开号：EP2573148A1

  公开（公告）日：2013-03-27

  Disclosed is an epoxy or epoxy-polyester curable powder coating composition which can form a favorable cured coating film excellent in adhesion and solvent resistance and is excellent in storage stability. The curable powder coating composition of the present invention contains the following component (A) and component (B): (A) an epoxy resin or an epoxy-polyester hybrid resin; and (B) a clathrate complex which contains (b1) at least one selected from the group consisting of a carboxylic acid compound and a tetrakisphenol compound represented by the following formula (I), and (b2) at least one selected from compounds represented by formula (II). The carboxylic acid compound preferably includes an aromatic carboxylic acid.

  本发明公开了一种环氧或环氧-聚酯可固化粉末涂料组合物，该组合物可形成附着力和耐溶剂性优异的固化涂膜，并具有出色的贮存稳定性。本发明的可固化粉末涂料组合物包含以下组分（A）和组分（B）：（A）环氧树脂或环氧-聚酯混合树脂；和（B）凝胶络合物，其中包含（b1）至少一种选自下式（I）所代表的羧酸化合物和四双酚化合物，以及（b2）至少一种选自下式（II）所代表的化合物。羧酸化合物最好包括芳香族羧酸。