p,p'-Bis-(4-aminophenyl)-phenylendisulfon | 57439-12-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: p,p'-Bis-(4-aminophenyl)-phenylendisulfon
• 英文别名: 1,4-bis(p-aminophenylsulfonyl)benzene；4-[4-(4-Aminophenyl)sulfonylphenyl]sulfonylaniline
• CAS: 57439-12-0
• 化学式: C₁₈H₁₆N₂O₄S₂
• 分子量: 388.468
• InChiKey: FALSKAFGDLHVDW-UHFFFAOYSA-N

物化性质

• 熔点：
  301-302 °C(Solv: ethanol (64-17-5); N,N-dimethylformamide (68-12-2))
• 沸点：
  683.5±50.0 °C(Predicted)
• 密度：
  1.434±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  26
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  137
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, METAL-PLATED TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, AND METHOD FOR PRODUCING THE SAME
  申请人：Ataka Kikuo

  公开号：US20100009206A1

  公开（公告）日：2010-01-14

  A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be composed of a triamine only); and a component (c): as a terminal component, a compound selected from general formulae (1-1) to (1-4). H 2 N—X—R 1 (1-1) (In the formula, X represents a single bond or an alkylene group having 1 to 3 carbon atoms, and R 1 represents a nitrogen-containing heterocyclic group). H 2 N—X—R 1 (1-2) (In the formula, X is as defined above, and R 1 represents a sulfur-containing heterocyclic group or an aryl group having a thiol or thioether group in the molecule). (In the formula, R represents a nitrogen-containing heterocyclic group). (In the formula, R represents a monovalent residue).

  通过反应组分(a):四羧酸二酐;组分(b):作为胺组分，三胺和二胺的混合物(可以仅由三胺组成);以及组分(c):作为末端组分，从通式(1-1)到(1-4)中选择的化合物，可以获得与无机材料高效络合的终止修饰的多支化聚酰亚胺。 H2N-X-R1(1-1)(式中，X表示单键或具有1到3个碳原子的烷基基团，R1表示含氮杂环基团)。 -X-R1(1-2)(式中，X如上定义，R1表示含硫杂环基团或分子中具有巯基或硫醚基团的芳基基团)。 (式中，R表示含氮杂环基团)。 (式中，R表示单价残基)。
• Aromatic polythioetheramides and process for their production
  申请人：MITSUBISHI PETROCHEMICAL CO., LTD.

  公开号：EP0162606A1

  公开（公告）日：1985-11-27

  Aromatic polythioetheramides have repeating units represented by one or both of the following formulae and wherein X is C1-C10 divalent hydrocarbon, -0-, -S-, - SO-, - SO2- or -CO-; a is 0 or 1; Y is C,-C20 alkyl, C3-C20 cycloalkyl, C6-C20 aralkyl, C6-C20 aryl, halogen or nitro; b, c, e and f, 0 to 4; d, 0-20 and Ar is a C6-C30 aromatic ring. Repeating units derived from C6-C30 aromatic diamines may replace up to 50 mol% of the above thioetheramide units, and from 51 to 99 mol% when Ar is isophthalyl or terephthalyl. The polymers have excellent moldability, flame retardance, heat resistance and chemical resistance, and are suitable for use as engineering plastics.

  芳香族聚硫醚酰胺的重复单元由以下一个或两个式子表示 和 其中 X 为 C1-C10 二价烃、-0-、-S-、-SO-、-SO2- 或-CO-；a 为 0 或 1；Y 为 C,-C20烷基、C3-C20 环烷基、C6-C20 芳基、C6-C20 芳基、卤素或硝基；b、c、e 和 f 为 0 至 4；d 为 0 至 20；Ar 为 C6-C30 芳环。 由 C6-C30 芳族二胺衍生的重复单元可取代高达 50 摩尔%的上述硫醚酰胺单元，当 Ar 为间苯二甲酸酯或对苯二甲酸酯时，可取代 51 至 99 摩尔%的上述硫醚酰胺单元。这些聚合物具有优异的成型性、阻燃性、耐热性和耐化学性，适合用作工程塑料。
• Curable resins, their preparation, and protective coatings for electronic parts
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：EP0448359A1

  公开（公告）日：1991-09-25

  A curable resin comprising a resin of the formula wherein R¹ and R² each are substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R³ is a divalent organic group having 1 to 10 carbon atoms, X is a tetravalent organic group having an aromatic ring, Y is a divalent organic group, m is an integer of 1 to 3, and n is an integer of at least 1. The resin is prepared by reacting a polyimide with an aminosilicon compound and can be cured through relatively mild heating into coatings having enhanced substrate adherence and solvent resistance.

  一种可固化树脂，由以下式子的树脂组成 其中 R¹ 和 R² 分别是具有 1 至 10 个碳原子的取代或未取代的一价烃基，R³ 是具有 1 至 10 个碳原子的二价有机基团，X 是具有芳香环的四价有机基团，Y 是二价有机基团，m 是 1 至 3 的整数，n 是至少 1 的整数。该树脂是通过聚酰亚胺与氨基硅化合物反应制备的，可通过相对温和的加热固化成具有更强基材附着力和耐溶剂性的涂层。
• Photosensitive polymer composition
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：EP0505161A1

  公开（公告）日：1992-09-23

  A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula ( I ): wherein X is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula ( II ): wherein R¹ is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R² and R³ are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.

  一种光敏聚合物组合物，包括主要由式 ( I ) 循环单元组成的聚合物： 其中 X 是三价或四价有机基团，Y 是二价有机基团，n 等于 1 或 2，以及具有式 ( II ) 脲键的化合物： 其中 R¹ 是具有官能团的基团，该官能团在暴露于辐射时能够形成二聚体或聚合物，R² 和 R³ 独立地为氢原子或一价有机基团。
• Curable resins, solutions thereof, processes for making them, and electronic part protective coatings
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：EP0553971A2

  公开（公告）日：1993-08-04

  A novel curable resin of structural formula (1) is provided wherein R1 and R2 are independently substituted or unsubstituted monovalent C1-10 hydrocarbon groups, R3 is a divalent C1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is O or NH, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with an isocyanatosilane. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300°C into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence.

  提供了一种结构式（1）的新型可固化树脂，其中 R1 和 R2 是独立取代或未取代的单价 C1-10 烃基，R3 是二价 C1-10 有机基团，X 是含有芳香环或脂肪环的四价有机基团，Y 是二价有机基团，Z 是含有芳香环的二价有机基团，W 是 O 或 NH，m 是 1 至 3 的整数，n 是至少 1 的整数。它可以通过聚酰亚胺与异氰酸硅烷反应制备。固化树脂与溶剂形成的溶液具有低粘度和货架稳定性，在低于 300°C 的相对低温下固化成具有耐热性、机械强度、电性能、耐溶剂性和基材附着力的涂层。