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3,3'-Bis-(trifluormethyl)-4,4'-diamino-diphenylether | 37957-20-3

中文名称
——
中文别名
——
英文名称
3,3'-Bis-(trifluormethyl)-4,4'-diamino-diphenylether
英文别名
4-[4-Amino-3-(trifluoromethyl)phenoxy]-2-(trifluoromethyl)aniline
3,3'-Bis-(trifluormethyl)-4,4'-diamino-diphenylether化学式
CAS
37957-20-3
化学式
C14H10F6N2O
mdl
——
分子量
336.237
InChiKey
QMIKGLAWPSCQOV-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    3.9
  • 重原子数:
    23
  • 可旋转键数:
    2
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.14
  • 拓扑面积:
    61.3
  • 氢给体数:
    2
  • 氢受体数:
    9

文献信息

  • Fluorinated bis(phthalic anhydride) and method for producing the same
    申请人:Masuda Go
    公开号:US20050020839A1
    公开(公告)日:2005-01-27
    It is an object of the present invention to provide fluorinated bis(phthalic anhydride) which has less coloration and higher solubility in comparison with conventional compounds, and a method for producing the same. Further, it is also an object of the present invention to provide a method for producing a fluorinated bis(phthalonitrile) compound, which is an intermediate raw material compound of the method for producing the fluorinated bis(phthalic anhydride), and a polyamic acid and a polyimide, which are produced from the fluorinated bis(phthalic anhydride). A fluorinated bis(phthalic anhydride) of the present invention is the fluorinated bis(phthalic anhydride) represented by the following formula (I 1 ), wherein its specific surface area is 3.0 m 2 /g or larger. It is also characterized in that its molar absorption coefficient is 0.6 L/mol·cm or less at a wavelength of 360 nm. [wherein, m and n independently represent integers of 1 to 3, and Z 1 represents a single bond group or a bivalent organic group.]
    本发明的目的是提供具有比传统化合物更少着色和更高溶解性的化双(邻苯二甲酸酐)以及其生产方法。此外,本发明还旨在提供一种用于生产化双(邻苯二腈)化合物的方法,该化合物是生产化双(邻苯二甲酸酐)的中间原料化合物,并且提供由化双(邻苯二甲酸酐)生产的聚酰胺酸和聚酰亚胺的方法。本发明的化双(邻苯二甲酸酐)是由以下式(I1)表示的化双(邻苯二甲酸酐),其中其比表面积为3.0 m2/g或更大。其特征在于,在360 nm波长处,其摩尔吸光系数不超过0.6 L/mol·cm。【其中,m和n独立表示1到3的整数,Z1表示单键基团或二价有机基团。】
  • POLYAMIC ACID RESIN SOLUTION CONTAINING INTERPENETRATING POLYMER AND LAMINATE USING THE SAME
    申请人:WANG Tsung-Hsiung
    公开号:US20130171459A1
    公开(公告)日:2013-07-04
    Provided is a polyamic acid resin solution containing interpenetrating polymer. The solution includes a polyamic acid resin dissolved in a solvent. The polyamic acid resin includes an interpenetrating polymer formed of polyamic acid twining around hyper-branched polybismaleimide. The hyper-branched polybismaleimide includes a bismaleimide polymer, a bismaleimide oligomer, a barbituric acid-bismaleimide copolymer or combinations thereof.
    提供的是一种含有相互渗透聚合物的聚酰亚胺树脂溶液。该溶液包括在溶剂中溶解的聚酰亚胺树脂。聚酰亚胺树脂包括由聚酰亚胺绕绕着超支化聚双马来酰亚胺形成的相互渗透聚合物。超支化聚双马来酰亚胺包括双马来酰亚胺聚合物、双马来酰亚胺寡聚物、巴比妥酸-双马来酰亚胺共聚物或其组合。
  • Polyimide optical waveguide
    申请人:NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    公开号:EP0454590A2
    公开(公告)日:1991-10-30
    An optical waveguide which has properties including low optical losses, facile fabrication, controllrable core - cladding refractive index ratio, and high heat resistance is provided. The optical waveguide for light transmission therethrough has a core (2) made of a polyimide obtained from at least one tetracarboxylic acid dianhydride and at least one diamine. The polyimide is (a) a polyimide homopolymer derived from a diamine represented by formula [I] as follows: (b) a polyimide copolymer derived from at least one diamine including the diamine represented by the formula [I]; or (c) a mixture of the polyimide homopolymers.
    本发明提供了一种光波导,它具有光损耗低、易于制造、芯材-包层折射率比可控以及耐热性高等特性。这种光波导具有一个由至少一种四羧酸二酐和至少一种二胺制成的聚酰亚胺芯(2),光通过该芯传输。聚酰亚胺是 (a) 由如下式[I]代表的二胺衍生的聚酰亚胺均聚物: (b) 由包括式[I]代表的二胺在内的至少一种二胺衍生的聚酰亚胺共聚物;或 (c) 聚酰亚胺均聚物的混合物。
  • Polyimide optical waveguide and method of manufacturing the same
    申请人:NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    公开号:EP0616234A2
    公开(公告)日:1994-09-21
    A polyimide optical waveguide comprising a core (2) made of polyimide whose refractive index is controlled to a predetermined value by electron beam irradiation, and a cladding (1, 3) set in contact with the core and having a refractive index lower than that of the core. A polyamic acid solution is spin-coated on a substrate such as of silicon, and is thermally cured to form a polyimide layer. An electron beam is irradiated on the entire surface of the polyimide layer to change the refractive index to a predetermined value. An electron beam-absorbed dose of the polyimide layer depends on the composition of the polyimide, an energy of the electron beam, and the applied amount of the electron beam irradiation. The refractive index changes in accordance therewith approximately. This polyimide layer irradiated with the electron beam is used as a core layer. Next, the same polyamic acid solution is spin-coated on the core layer, and is thermally cured. The material is separated from the substrate to obtain a polyimide film of a two-layer structure. Then, the polyimide film of a two-layer structure is made to reverse and the irradiated polyimide layer is made to the upper surface. The lower surface of the reversed film is adhered by a method such as a thermo-compression bonding on the other silicon substrate. Next, the core layer is patterned into a desired shape, for example, a rectangular shape, by RIE (reactive ion etching) method. Finally, the same polyamic acid solution is spin-coated over the patterned core layer, as an upper cladding lacer, and is thermally cured, thereby preparing an embedded channel waveguide.
    一种聚酰亚胺光波导,包括一个由聚酰亚胺制成的芯子(2),其折射率可通过电子束辐照控制到预定值;以及一个与芯子接触的包层(1,3),其折射率低于芯子的折射率。 将聚酰胺酸溶液旋涂在等基底上,并通过热固化形成聚酰亚胺层。电子束照射聚酰亚胺层的整个表面,使折射率变为预定值。聚酰亚胺层的电子束吸收剂量取决于聚酰亚胺的成分、电子束的能量和电子束辐照的应用量。折射率大致随之变化。 经电子束辐照的聚酰亚胺层被用作核心层。 然后,在芯层上旋涂相同的聚酰胺酸溶液,并进行热固化。材料与基底分离,得到双层结构的聚酰亚胺薄膜。 然后,将双层结构的聚酰亚胺薄膜反转,使辐照聚酰亚胺层位于上表面。反转薄膜的下表面通过热压接合等方法粘附在另一块衬底上。 然后,用 RIE(反应离子蚀刻)方法将芯层图案化为所需的形状,例如矩形。 最后,将相同的聚酰胺酸溶液旋涂在图案化的芯层上,作为上覆层,并进行热固化,从而制备出嵌入式通道波导。
  • Thermosetting resin compositions and their use for thin film wiring boards
    申请人:HITACHI, LTD.
    公开号:EP0618269A1
    公开(公告)日:1994-10-05
    The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10² to 10⁷ dyne/cm² in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
    本发明涉及一种热固性树脂组合物,该组合物由(A)热固性聚酰亚胺和(B)双马来酰亚胺组成,在热固化步骤中显示出 10² 至 10⁷ 戴恩/平方厘米的弹性模量,适用于形成薄膜布线板中使用的胶膜,具有优异的耐热性和高可靠性。本发明还涉及前体化合物和组合物。
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