3,4'-diamino-4-phenoxybenzophenone | 157632-61-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,4'-diamino-4-phenoxybenzophenone
• 英文别名: (3-amino-4-phenoxyphenyl)-(4-aminophenyl)methanone
• CAS: 157632-61-6
• 化学式: C₁₉H₁₆N₂O₂
• 分子量: 304.348
• InChiKey: PHPTWVBSQRENOR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.1
• 重原子数：
  23
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  78.3
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  3,4'-Dinitro-4-phenoxybenzophenone 在 盐酸 、 tin(ll) chloride 作用下， 生成 3,4'-diamino-4-phenoxybenzophenone
  参考文献：
  名称：

  Damaceanu, Mariana-Dana; Rusu, Radu-Dan; Bruma, Maria, Revue Roumaine de Chimie, 2012, vol. 57, # 9-10, p. 799 - 806

  摘要：

  DOI：

文献信息

• Polyimide, and preparation process of same
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0572196A1

  公开（公告）日：1993-12-01

  This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, and a preparation process thereof. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: wherein m and n are individually an integer of 0 or 1, and R is The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability. The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.

  本发明涉及一种易溶于有机溶剂的新型热塑性无定形聚酰亚胺、一种用于聚酰亚胺的新型芳香族二氨基化合物及其制备工艺。 该聚酰亚胺包括一个必要的结构单元，该结构单元具有一个或多个式中的重复结构单元： 其中 m 和 n 分别是 0 或 1 的整数，R 是 本发明的聚酰亚胺基本上是无定形的，与传统已知的聚酰亚胺相比，在温度降低时熔体流动稳定性极佳，而且加工性能大大提高。 使用新型芳香族二氨基化合物作为单体得到的本发明聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制熔体流动能力和在溶剂中的溶解度等各种性能。因此，在保持本发明二氨基化合物的二苯甲酮结构所产生的高耐热性和粘合性的同时，还能获得优异的熔体流动性能和在溶剂中的溶解性。
• Polyimide-based resin composition
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0639621A2

  公开（公告）日：1995-02-22

  The present invention relates to a polyimide-based resin composition comprising a thermoplastic polyimide having good solubility in general purpose organic solvents and a fibrous reinforcement such as carbon fiber, glass fiber, aromatic polyamide fiber and/or a potassium titanate fiber, a process for preparing the resin composition and an injection molded article of the resin composition, and further relates to a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement and a process for molding the same. The polyimide used for the invention can be applied as a surface modifier for the fibrous reinforcement particularly in the form of a solution and provide a fibrous reinforcement having a surface modified with the above polyimide.

  本发明涉及一种聚酰亚胺基树脂组合物，该组合物包括一种在通用有机溶剂中具有良好溶解性的热塑性聚酰亚胺和一种纤维状增强材料，如碳纤维、玻璃纤维、芳香族聚酰胺纤维和/或钛酸钾纤维；本发明还涉及一种制备该树脂组合物的工艺和一种用该树脂组合物注塑成型的制品；本发明还涉及一种通过将上述可溶性热塑性聚酰亚胺与纤维状增强材料组合成型而获得的聚酰亚胺基复合材料及其成型工艺。 用于本发明的聚酰亚胺可以作为纤维增强材料的表面改性剂，特别是以溶液的形式使用，并提供一种表面经上述聚酰亚胺改性的纤维增强材料。
• Linear polyamic acid, linear polyimide and thermoset polyimide
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0751168A1

  公开（公告）日：1997-01-02

  Novel thermoset polyimide and a composite materials comprising the thermoset polyimide and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomer or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarbo xylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimide of this invention has essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. This invention can provide various kind of composite materials for aircraft matrix, electric and electronic appliances and others. A preferred polyimide is of formula:

  根据本发明制备了新型热固性聚酰亚胺和由热固性聚酰亚胺和纤维增强材料组成的复合材料。 热固性聚酰亚胺是通过热处理线性聚酰胺或线性聚酰亚胺获得的，线性聚酰胺或线性聚酰亚胺是以 4,4'-双（3-氨基苯氧基）联苯和偏苯二酸酐为基本单体或加入 4、4'-二氨基二苯醚或 3,3',4,4'-联苯四羧酸二酐作为基本单体，并用具有碳碳三键的芳香族二羧酸酐作为分子链末端的封端。 本发明的热固性聚酰亚胺具有热塑性聚酰亚胺的基本优良性能，此外还具有更强的耐热性和更好的机械性能。本发明可为飞机基体、电气和电子设备等提供各种复合材料。 优选的聚酰亚胺的化学式为
• CURABLE COMPOSITION
  申请人：Toyo Boseki Kabushiki Kaisha

  公开号：EP1700874A1

  公开（公告）日：2006-09-13

  A curable resin composition that forms a continuous phase and a dispersoid at normal temperatures, wherein the continuous phase is a liquid at normal temperatures and comprises (a) an epoxy compound having two or more epoxy groups in a molecule, and the dispersoid comprises (b) a compound present as solid particles in a continuous phase at normal temperatures and having two or more amino groups in a molecule (preferably, an aromatic amine compound having a benzoxazole structure). The present invention provides a one-component epoxy curable composition superior in the preservation stability and showing good properties of the cured product.

  一种在常温下形成连续相和分散体的可固化树脂组合物，其中连续相在常温下为液态，包括(a)分子中含有两个或两个以上环氧基团的环氧化合物，分散体包括(b)在常温下以固体颗粒形式存在于连续相中，分子中含有两个或两个以上氨基基团的化合物（最好是具有苯并恶唑结构的芳香胺化合物）。本发明提供了一种单组分环氧树脂固化组合物，该组合物在保存稳定性方面更胜一筹，且固化后的产品性能良好。
• POLYIMIDE FILM
  申请人：Toyo Boseki Kabushiki Kaisha

  公开号：EP1707590A1

  公开（公告）日：2006-10-04

  [Summary] [Problems] Provision of a polyimide film superior in heat resistance, rigidity and high frequency property, which is free of inconveniences due to curling even when various functional layers are laminated with heating, and which is preferable as a substrate film superior in thermal degradation stability for electronic parts. [Solving Means] A polyimide film having a planar orientation coefficient of 0.79-0.89 as measured by an X-ray diffraction method, a difference in the surface planar orientation degree between one surface thereof and the other surface thereof of not more than 2 and a curling degree of not more than 5%, which is obtained by imidation of a polyimide precursor film having a particular imidation rate.

  摘要 [问题]提供一种聚酰亚胺薄膜，该薄膜具有优异的耐热性、刚性和高频特性，即使在加热层叠各种功能层时，也不会因卷曲而造成不便，而且作为电子部件的基底薄膜，其热降解稳定性更佳。[解决方法] 一种聚酰亚胺薄膜，通过 X 射线衍射法测得其平面取向系数为 0.79-0.89，其一个表面与另一个表面的表面平面取向度之差不超过 2，卷曲度不超过 5%，该薄膜是通过具有特定亚胺化率的聚酰亚胺前体薄膜亚胺化而得到的。