bis-(4-oxiranyl-phenyl)-ether | 5280-88-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: bis-(4-oxiranyl-phenyl)-ether
• 英文别名: Bis-(4-oxiranyl-phenyl)-aether；2,2'-(Oxydibenzene-4,1-diyl)dioxirane；2-[4-[4-(oxiran-2-yl)phenoxy]phenyl]oxirane
• CAS: 5280-88-6
• 化学式: C₁₆H₁₄O₃
• 分子量: 254.285
• InChiKey: NQNRJGLDZNCKRR-UHFFFAOYSA-N

物化性质

• 熔点：
  93.5-94 °C(Solv: methanol (67-56-1))
• 沸点：
  395.7±42.0 °C(Predicted)
• 密度：
  1.283±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  34.3
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  氯苯醚特 在 氢氧化钾 、 aluminum isopropoxide 、 异丙醇 作用下， 生成 bis-(4-oxiranyl-phenyl)-ether
  参考文献：
  名称：

  据了解芳族二环氧化物和三环氧化物。第三次沟通

  摘要：

  1.以另一种方式再次制备较早显示的1,3,5-三-（环氧乙基）苯，除了已描述的具有1的1,3,5-三（环氧乙基）苯的化合物外，还获得了更高的熔点（熔点为81.5°）。熔点64°。结果表明，这是两个可能的消旋体。

  DOI：

  10.1002/hlca.19590420718

文献信息

• [EN] HIGH HEAT MONOMERS AND METHODS OF USE THEREOF<br/>[FR] MONOMÈRES À CHALEUR ÉLEVÉE ET LEURS PROCÉDÉS D'UTILISATION
  申请人：SABIC GLOBAL TECHNOLOGIES BV

  公开号：WO2016014536A1

  公开（公告）日：2016-01-28

  High purity epoxide compounds, methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.

  本发明提供了高纯度环氧化合物、制备高纯度环氧化合物的方法以及从环氧化合物衍生的组合物。还提供了从环氧化合物衍生的材料和物品。
• [EN] HIGH HEAT DIEPOXY COMPOUNDS, PROCESSES OF MAKING, AND USES THEREOF<br/>[FR] COMPOSÉS DIÉPOXY À HAUTE TEMPÉRATURE, LEURS PROCÉDÉS DE FABRICATION ET LEURS UTILISATIONS
  申请人：SABIC GLOBAL TECHNOLOGIES BV

  公开号：WO2020028803A1

  公开（公告）日：2020-02-06

  A diepoxy phthalimidine of formula (2) wherein R1, R2, Ra, Rb, R13, R14, p, q, and c are as provided herein, wherein the diepoxy phthalimidine of formula (2) has a purity of greater than 60%, preferably greater than 70%, preferably greater than 80%, preferably greater than 90%, preferably greater than 95%, preferably greater than 98%, and preferably greater than 99% as determined by high performance liquid chromatography, or wherein the diepoxy phthalimidine of formula (2) has an epoxy equivalent weight of 1.0 to 1.5, preferably 1.0 to 1.2, more preferably 1.0 to 1.15, even more preferably 1.0 to 1.1 times relative to the theoretical EEW, or a combination of the purity and epoxy equivalent weight.

  公式（2）中的双环氧酞酰亚胺，其中R1、R2、Ra、Rb、R13、R14、p、q和c如本文所述，其中公式（2）中的双环氧酞酰亚胺的纯度大于60％，优选大于70％，更优选大于80％，更优选大于90％，更优选大于95％，更优选大于98％，并且最好大于99％，由高效液相色谱法确定，或者公式（2）中的双环氧酞酰亚胺的环氧当量重量为1.0至1.5，优选为1.0至1.2，更优选为1.0至1.15，甚至更优选为相对于理论环氧当量重量的1.0至1.1倍，或纯度和环氧当量重量的组合。
• Bisimide-ether compounds, compositions containing these compounds, and a method for their production
  申请人：Hitachi, Ltd.

  公开号：EP0004592A1

  公开（公告）日：1979-10-17

  A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound : wherein R, is a group containing at least two carbon atoms, R2 is a group containing at least two carbon atoms, R'2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R2 or R'2, the oxygen atoms between the groups R2 and R3 being directly connected to an aromatic nucleus of the group R3, and n is an integer of zero, one or more than 1.

  将乙烯基不饱和二羧酸酐、二胺化合物和分子中含有至少两个羟基的酚类化合物反应，或将酐和二胺化合物的预聚物与酚类化合物反应，可得到通式为...的双亚胺醚化合物： 其中 R, 是至少含有两个碳原子的基团，R2 是至少含有两个碳原子的基团，R'2 是至少含有两个碳原子和一个碳碳双键的基团，R3 是芳香基团，亚胺环的氮原子直接连接到基团 R1 的不同碳原子上、亚胺环的羰基与基团 R2 或 R'2 的不同碳原子直接相连，基团 R2 和 R3 之间的氧原子与基团 R3 的芳香族核直接相连，n 为 0、1 或 1 以上的整数。
• Ether imides and process for producing the same
  申请人：Hitachi, Ltd.

  公开号：EP0032745A2

  公开（公告）日：1981-07-29

  An ether imide of the formula: wherein R1, R2, R3, R4, R5, R6 and D are as defined in the specification produced by reacting a diamine with an ethylenically unsaturated dicarboxylic acid can give a composition together with one or more unsaturated polyesters, epoxy compounds, amines, and the like to give shaped ar- ticies excellent in flexibility and heat resistance.

  式中的醚酰亚胺 其中 R1、R2、R3、R4、R5、R6 和 D 如说明书中所定义，由二元胺与乙烯基不饱和二羧酸反应而制得，可与一种或多种不饱和聚酯、环氧化合物、胺等一起制成一种组合物，从而得到具有优异柔韧性和耐热性的成型材料。
• Multi-layer printed circuit board and process for production thereof
  申请人：Hitachi, Ltd.

  公开号：EP0059434A2

  公开（公告）日：1982-09-08

  A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg, and that of T92 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg, and Tg2, has excellent dimensional stability, heat resistance and through-hole reliability.

  一种通过预浸树脂片层压多个单元电路板而生产的多层印刷电路板，所述单元电路板中的固化树脂的玻璃化转变温度为 Tg1，所述预浸树脂片是用一种树脂组合物浸渍增强基板而制备的，该树脂组合物可在等于或低于预浸树脂片中树脂的玻璃化转变温度 Tg 和 T92 的温度下固化、和 T92 的温度下固化，并在等于或低于 Tg 和 Tg2 的温度下加压加热粘合层压板，从而获得具有优异尺寸稳定性、耐热性和通孔可靠性的预浸树脂板。