4,4-Bis[2-(1-propenyl)phenoxy]benzophenone | 109423-33-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4-Bis[2-(1-propenyl)phenoxy]benzophenone
• 英文别名: bis[4-[2-[(E)-prop-1-enyl]phenoxy]phenyl]methanone
• CAS: 109423-33-8
• 化学式: C₃₁H₂₆O₃
• 分子量: 446.5
• InChiKey: JRZSSQRNBKDVDD-LQIBPGRFSA-N

物化性质

• 熔点：
  43-45 °C(lit.)
• 沸点：
  576.6±50.0 °C(Predicted)
• 密度：
  1.143±0.06 g/cm3(Predicted)
• 稳定性/保质期：

  如果按照规格使用和储存，则不会分解，没有已知危险反应。应避免与强氧化物接触。

计算性质

• 辛醇/水分配系数(LogP)：
  8.3
• 重原子数：
  34
• 可旋转键数：
  8
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.06
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

安全信息

• 危险品标志：
  Xi
• 危险类别码：
  R36/37/38
• 海关编码：
  2914509090
• 安全说明：
  S26,S36

文献信息

• [EN] [(2-ETHOXY-5-TRANS-1-PROPEN-1-YL)-PHENOXYL]-TERMINATED COMPOUNDS<br/>[FR] COMPOSÉS À TERMINAISON [(2-ÉTHOXY-5-TRANS-1-PROPÉN-1-YL)-PHÉNOXYLE]
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045931A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers:, (I) wherein Dis an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：（I）其中D是一个x官能团；x是大于等于2的整数；但需注意x官能团D不是具有平均摩尔质量在15000克/摩尔至150000克/摩尔范围内的聚碳酸酯。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可以在结构胶、纤维预浸料的基体树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] THERMOSETTING RESIN COMPOSITIONS<br/>[FR] COMPOSITIONS DE RÉSINE THERMODURCISSABLE
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2017108946A1

  公开（公告）日：2017-06-29

  Meta and para alkenyl phenols are reacted with hydroxyl benzophenone to produce compounds of the genera formula or which are used as curatives for polymaleimide resins.

  甲基和对烯基酚与羟基苯甲酮反应，产生通式化合物，用作聚马来酰亚胺树脂的固化剂。
• [EN] ALKENYLPHENOXY-SUBSTITUTED 1,1-DIPHENYLETHYLENES, PROCESSES FOR THEIR PREPARATION, AND THEIR USE<br/>[FR] 1,1-DIPHÉNYLÉTHYLÈNES SUBSTITUÉS PAR UN ALCÉNYLPHÉNOXY, LEURS PROCÉDÉS DE PRÉPARATION ET LEUR UTILISATION
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045932A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及根据式(I)的化合物以及基于聚马来酰亚胺树脂体系的热固性组合物，其中这些化合物作为共聚单体：其中R1是氢或烯基苯氧基，R2是烯基苯氧基，R3是氢或具有1至4个碳原子的烷基基团。本发明还涉及通过固化这种组合物获得的交联树脂。本发明的化合物可以在结构粘合剂、纤维预浸料的基质树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] CYCLOPROPENIUM POLYMERS AND METHODS FOR MAKING THE SAME<br/>[FR] POLYMÈRES DE CYCLOPROPÉNIUM ET LEURS PROCÉDÉS DE FABRICATION
  申请人：UNIV COLUMBIA

  公开号：WO2014022365A1

  公开（公告）日：2014-02-06

  The present invention provides, inter alia, a process for incorporating a cyclopropenium ion into a polymeric system. Processes for making cross-linked polymers, linear polymers, and dendritic polymers, as well as for incorporating a cyclopropenium ion onto a preformed polymer are also provided. Further provided are stable, polycationic compounds, various polymers that contain stable cyclopropenium cations, and substrates containing such polymers. The use of these polymers in water purification systems, antimicrobial coatings, ion-transport membranes, cell supports, drug delivery vehicles, and gene therapeutic vectors are also provided.

  本发明提供了将环丙烯离子引入聚合体系的方法。还提供了制备交联聚合物、线性聚合物和树枝状聚合物的方法，以及将环丙烯离子引入预先形成的聚合物的方法。此外，还提供了稳定的多阳离子化合物、含有稳定环丙烯阳离子的各种聚合物，以及含有这些聚合物的基板。还提供了在水净化系统、抗微生物涂层、离子传输膜、细胞支撑、药物输送载体和基因治疗载体中使用这些聚合物的方法。
• [EN] ASYMMETRICALLY SUBSTITUTED BIS-ALKENYL DIPHENYL ETHERS, THEIR PREPARATION AND USE<br/>[FR] ÉTHERS DE BIS-ALCÉNYLE DIPHÉNYLE SUBSTITUÉS DE MANIÈRE ASYMÉTRIQUE, LEUR PRÉPARATION ET LEUR UTILISATION
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2018091253A1

  公开（公告）日：2018-05-24

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 signifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein R2 signifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein R3 signifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein R4 signifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：其中R1表示具有3到6个碳原子的1-烯基或2-烯基基团，R2表示氢或具有最多2个碳原子的烷氧基团，R3表示氢或具有最多4个碳原子的烷基团，R4表示氢或具有最多4个碳原子的烷基团。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可用于结构胶粘剂、纤维预浸料基体树脂、成型复合材料以及结构和/或电气复合材料等领域。