This polyimide film is superior in heat resistance, rigidity and high frequency properties, is free of inconveniences due to curling even when various functional layers are laminated by heating, and is preferable as a substrate film superior in thermal degradation stability for electronic parts. This polyimide film has a planar orientation coefficient of 0.79-0.89 as measured by an X-ray diffraction method, a difference in the surface planar orientation degree between one surface thereof and the other surface thereof of not more than 2 and a curling degree of not more than 5%, which is obtained by imidation of a polyimide precursor film having a particular imidation rate.
Curable Composition
申请人:Yoshida Takefumi
公开号:US20070293588A1
公开(公告)日:2007-12-20
A curable resin composition that forms a continuous phase and a dispersoid at normal temperatures, wherein the continuous phase is a liquid at normal temperatures and comprises (a) an epoxy compound having two or more epoxy groups in a molecule, and the dispersoid comprises (b) a compound present as solid particles in a continuous phase at normal temperatures and having two or more amino groups in a molecule (preferably, an aromatic amine compound having a benzoxazole structure). The present invention provides a one-component epoxy curable composition superior in the preservation stability and showing good properties of the cured product.