Diphenyl-α.α-difluormethan-tetracarbonsaeure | 38845-76-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Diphenyl-α.α-difluormethan-tetracarbonsaeure
• 英文别名: 4-[(3,4-Dicarboxyphenyl)-difluoromethyl]phthalic acid
• CAS: 38845-76-0
• 化学式: C₁₇H₁₀F₂O₈
• 分子量: 380.258
• InChiKey: BMNKWSYVOVYDDU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.1
• 重原子数：
  27
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.06
• 拓扑面积：
  149
• 氢给体数：
  4
• 氢受体数：
  10

文献信息

• Thermosetting resin composition, resin sheet, prepreg and laminated sheet
  申请人：NITTO DENKO CORPORATION

  公开号：EP0422379A2

  公开（公告）日：1991-04-17

  A thermosetting resin composition, and a resin sheet, a prepreg and a laminated sheet using the composition are disclosed, which composition comprises (A) an amine-terminated oligomer represented by formula (I): wherein Ar₁ represents a divalent aromatic group, Ar₂ represents a tetravalent aliphatic or aromatic group, and a represents an integer of at least 1; and (B) a polymaleimide represented by formula (II): wherein Ar₃ represents an aliphatic group having two or more carbon atoms or an aromatic group, and b represents an integer of at least 2, provided that a part or the whole of hydrogen atoms of at least one group of Ar₁, Ar₂ and Ar₃ in formulae (I) and (II) is substituted by fluorine atoms.

  本发明公开了一种热固性树脂组合物以及使用该组合物的树脂板、预浸料和层压板，该组合物包括 (A) 由式 (I) 表示的胺封端低聚物： 其中 Ar₁ 代表二价芳香族基团，Ar₂ 代表四价脂肪族或芳香族基团，a 代表至少 1 的整数；以及 (B) 由式 (II) 代表的聚马来酰亚胺： 其中 Ar₃ 代表具有两个或两个以上碳原子的脂肪族基团或芳香族基团，且 b 代表至少 2 的整数，条件是式(I)和(II)中 Ar₁、Ar₂ 和 Ar₃ 的至少一个基团的部分或全部氢原子被氟原子取代。
• Heat resistant resin composition and adhesive film
  申请人：——

  公开号：US20030158350A1

  公开（公告）日：2003-08-21

  A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

  一种树脂组合物由骨架中含有酸酐基团的聚酰亚胺树脂与环氧树脂固化催化剂、环氧树脂和可选的环氧树脂固化剂的相关产物组成，具有优异的粘合性、耐热性、货架稳定性和耐溶剂性。由该树脂组合物组成的胶膜可用作印刷电路板和半导体封装的粘合剂或密封剂。
• Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
  申请人：——

  公开号：US20040019174A1

  公开（公告）日：2004-01-29

  A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

  一种骨架中含有酚羟基的聚酰亚胺树脂是用一种二胺制备的，该二胺带有一个芳香环，该芳香环上连接有一个氨基，另一个芳香环上连接有一个酚羟基。该聚酰亚胺树脂和由该聚酰亚胺树脂、环氧树脂和固化剂组成的组合物适用于需要粘附性和耐热性的清漆、粘合剂和粘合膜。
• Wafer dicing/die bonding sheet
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：US20040105990A1

  公开（公告）日：2004-06-03

  In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

  在一种晶片切割/晶片粘接片中，包括衬底部件、粘接层和保护部件，粘接层由粘接组合物制成，该组合物包括含酚醛羟基的聚酰亚胺树脂、环氧树脂和环氧树脂固化剂，环氧树脂和环氧树脂固化剂的总重量与聚酰亚胺树脂的重量比为 0.1:1 至 3:1。 由于具有耐热性、更好的粘合性能和较低的弹性模量，晶片切割/芯片粘接片可有效减少芯片在芯片粘接后的翘曲。
• JPH02208324A
  申请人：——

  公开号：JPH02208324A

  公开（公告）日：1990-08-17