2-Iod-3.4-dimethyl-thiophen | 98140-52-4

• 分子结构分类: 有机化合物 - 有机卤素化合物 - 芳基卤化物
• 英文名称: 2-Iod-3.4-dimethyl-thiophen
• 英文别名: 2-iodo-3,4-dimethyl-thiophene；2-Iodo-3,4-dimethylthiophene
• CAS: 98140-52-4
• 化学式: C₆H₇IS
• 分子量: 238.092
• InChiKey: QVNQGKGKUSHVMX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  8
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  28.2
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• Composition, hole transport material composition, and ink composition
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US11118005B2

  公开（公告）日：2021-09-14

  Embodiments of the present invention relate to a composition containing a polymer or oligomer (A) and an initiator (B), wherein the polymer or oligomer (A) contains no alkyl groups of 5 or more carbon atoms, contains at least one type of structural unit selected from the group consisting of a structural unit containing an aromatic amine structure and a structural unit containing a carbazole structure, and contains, at one or more terminals, a structural unit containing a thienyl group which may have a substituent, and a degree of solubility of the composition is capable of being changed by applying heat, light, or both heat and light.

  本发明的实施例涉及一种包含聚合物或寡聚物 (A) 和引发剂 (B) 的组合物，其中所述聚合物或寡聚物 (A) 不含具有 5 个或更多碳原子的烷基基团，包含至少一种选自芳香胺结构的结构单元和包含咔唑结构的结构单元中的结构单元，且在一端或多端包含带有可具有取代基的噻吩基团的结构单元，所述组合物的溶解度能够通过施加热、光或热和光的组合而改变。
• COMPOSITION, HOLE TRANSPORT MATERIAL COMPOSITION, AND INK COMPOSITION
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US20200048408A1

  公开（公告）日：2020-02-13

  Embodiments of the present invention relate to a composition containing a polymer or oligomer (A) and an initiator (B), wherein the polymer or oligomer (A) contains no alkyl groups of 5 or more carbon atoms, contains at least one type of structural unit selected from the group consisting of a structural unit containing an aromatic amine structure and a structural unit containing a carbazole structure, and contains, at one or more terminals, a structural unit containing a thienyl group which may have a substituent, and a degree of solubility of the composition is capable of being changed by applying heat, light, or both heat and light.