申请人:Sumitomo Bakelite Company Limited
公开号:US05284899A1
公开(公告)日:1994-02-08
A resin paste for tight sealing, comprising (A) at least one filler selected from the group consisting of Ag, Au, Cu, diamond, high-temperature sintered graphite and beryllia, (B) at least one metal filler selected from the group consisting of Al, Fe and Mg, (C) a polyimide resin having an imidization degree of 80% or more, obtained by reacting 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride or 3,3',4,4'-oxydiphthalic acid dianhydride with a diamine, and (D) an organic solvent, wherein the weight proportions of (A), (B) and (C) are (A)/[(B)+(C)]=10/90 to 90/10 (B)/[(A)+(C)]=5/95 to 90/10 and the weight proportion of (D) is (D)/[(A)+(B)+(C)]=0.01/100 to 50/100.
一种用于紧密密封的树脂浆料,包括(A)至少一种填料,所述填料从Ag、Au、Cu、金刚石、高温烧结石墨和铍氧化物中选择,(B)至少一种金属填料,所述金属填料从Al、Fe和Mg中选择,(C)聚酰亚胺树脂,其酰亚胺化程度为80%或更高,通过3,3',4,4'-苯并四酸酐或3,3',4,4'-氧二苯甲酸酐与二胺反应而得,以及(D)有机溶剂,其中(A)、(B)和(C)的重量比为(A)/[(B)+(C)] = 10/90至90/10,(B)/[(A)+(C)] = 5/95至90/10,(D)的重量比为(D)/[(A)+(B)+(C)] = 0.01/100至50/100。