4,4'-ethylidenebis(2-amino-3,6-dimethylphenol) | 1021497-28-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-ethylidenebis(2-amino-3,6-dimethylphenol)
• 英文别名: 2-Amino-4-[1-(3-amino-4-hydroxy-2,5-dimethylphenyl)ethyl]-3,6-dimethylphenol
• CAS: 1021497-28-8
• 化学式: C₁₈H₂₄N₂O₂
• 分子量: 300.401
• InChiKey: PVCLJGNTXBJWFT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  22
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  92.5
• 氢给体数：
  4
• 氢受体数：
  4

文献信息

• BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT
  申请人：Terakawa Koji

  公开号：US20100044888A1

  公开（公告）日：2010-02-25

  A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.

  本发明提供了一种在两个氨基团相邻位置上具有取代基的双(氨基酚)衍生物。该双(氨基酚)衍生物用作聚酰胺树脂的原材料，用于制备正向感光树脂组合物。还提供了一种聚酰胺树脂，包括双(氨基酚)和由羧酸衍生的结构，其中双(氨基酚)在两个氨基团相邻位置上具有取代基。提供了一种正向感光树脂组合物，包括聚苯并噁唑前体树脂，即使在低温下固化，也表现出高灵敏度和高环化速率。还提供了一种正向感光树脂组合物，包括具有酰亚胺结构、酰亚胺前体结构或酰胺酸酯结构的聚酰胺树脂。该组合物表现出高灵敏度，即使在低温下固化，也能产生低吸水性的固化产物。
• BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING THE SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PROTECTIVE FILM, INTERLAYER DIELECTRIC, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：EP2077291A1

  公开（公告）日：2009-07-08

  A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature:

  本发明提供了一种双（氨基苯酚）衍生物，其取代基位于两个氨基的相邻位置。双（氨基苯酚）衍生物可用作正色调感光树脂组合物聚酰胺树脂的原料。还提供了一种由双（氨基苯酚）和衍生自羧酸的结构组成的聚酰胺树脂，双（氨基苯酚）在邻近两个氨基的位置上具有取代基。本发明提供了一种包含聚苯并恶唑前体树脂的正色调光敏树脂组合物，即使在低温固化时也能表现出高灵敏度和高环化率。还提供了一种正色调感光树脂组合物，该组合物由具有亚胺结构、亚胺前体结构或酰胺酸酯结构的聚酰胺树脂组成。该组合物具有高灵敏度，即使在低温下固化，也能产生低吸水性的固化产品：
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME, AND DISPLAY DEVICE
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2113810A1

  公开（公告）日：2009-11-04

  A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250°C to a cyclization rate [B] (%) at 300°C of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.

  光敏树脂组合物包括具有聚苯并恶唑前体结构或聚酰亚胺前体结构或两者的碱溶性树脂和光敏剂，碱溶性树脂在250℃时的环化率[A](%)与300℃时的环化率[B](%)之比([A]/[B])为0.70或以上。根据本发明，可以提供一种在制造半导体器件时具有高灵敏度和高生产率的光敏树脂组合物、固化膜、保护膜、绝缘膜以及使用该固化膜的半导体器件和显示器件。
• POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2309329A1

  公开（公告）日：2011-04-13

  An object of the present invention is to provide a positive photosensitive resin composition which has high sensitivity and which is highly heat resistant and reliable even when it is cured at a low temperature. Another object of the present invention is to provide a cured film which has high sensitivity and which is highly heat resistant and reliable even when it is cured at a low temperature, a protecting film, an insulating film and semiconductor and display devices using the same. The positive photosensitive resin composition of the present invention comprises a polyamide resin and a photosensitive agent, wherein the polyamide resin has a specific structure. The cured film of the present invention comprises a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention comprise the cured film each. The semiconductor device and display device of the present invention comprise the cured film each.

  本发明的一个目的是提供一种即使在低温下固化也具有高灵敏度和高耐热性及可靠性的正性感光树脂组合物。本发明的另一个目的是提供一种即使在低温下固化也具有高灵敏度、高耐热性和高可靠性的固化膜、保护膜、绝缘膜以及使用这种膜的半导体和显示器件。 本发明的正感光树脂组合物由聚酰胺树脂和感光剂组成，其中聚酰胺树脂具有特定的结构。本发明的固化薄膜包括正性光敏树脂组合物的固化产物。本发明的保护膜和绝缘膜分别包括固化膜。本发明的半导体器件和显示器件分别包括固化膜。
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME
  申请人：Makabe Hiroaki

  公开号：US20100062273A1

  公开（公告）日：2010-03-11

  A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.