An organic film-forming polymer has a T
g
of at least 70° C. and comprises a backbone comprising recurring units of Structure (A) shown in this application. These organic film-forming polymers can be used as dielectric materials in various devices with improved properties such as improved mobility.
一种有机膜形成聚合物具有至少70℃的
玻璃转移温度(Tg),其包括由本申请中所示的结构(A)的重复单元组成的骨架。这些有机膜形成聚合物可用作各种设备中的介电材料,并具有改善的性能,例如改善的迁移性。