Aluminum compound and method for manufacturing semiconductor device using the same
申请人:SAMSUNG ELECTRONICS CO., LTD.
公开号:US11332486B2
公开(公告)日:2022-05-17
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
本文提供了一种铝化合物和使用该铝化合物制造半导体器件的方法。铝化合物可由式 1 表示。