4,4'-Bis-(3-methyl-4-amino-phenoxy)-diphenylsulfon | 30203-14-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-Bis-(3-methyl-4-amino-phenoxy)-diphenylsulfon
• 英文别名: 4-[4-[4-(4-Amino-3-methylphenoxy)phenyl]sulfonylphenoxy]-2-methylaniline
• CAS: 30203-14-6
• 化学式: C₂₆H₂₄N₂O₄S
• 分子量: 460.554
• InChiKey: HTKJIDFYYFXCCA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.1
• 重原子数：
  33
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  113
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• Epoxy compositions containing substituted diamine hardeners
  申请人：AMOCO CORPORATION

  公开号：EP0135647B1

  公开（公告）日：1988-07-06
• EPOXY/AROMATIC AMINE RESIN SYSTEMS CONTAINING AROMATIC TRIHYDROXY COMPOUNDS AS CURE ACCELERATORS
  申请人：UNION CARBIDE CORPORATION

  公开号：EP0229770A1

  公开（公告）日：1987-07-29
• FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES
  申请人：Cytec Industries Inc.

  公开号：EP2997100A1

  公开（公告）日：2016-03-23
• FORMULATED RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES
  申请人：Cytec Industries Inc.

  公开号：US20150077947A1

  公开（公告）日：2015-03-19

  Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.
• US4579885A
  申请人：——

  公开号：US4579885A

  公开（公告）日：1986-04-01