1,3-bis(3-(3-aminophenoxy)phenoxy)benzene | 500577-28-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1,3-bis(3-(3-aminophenoxy)phenoxy)benzene
• 英文别名: 3-[3-[3-[3-(3-Aminophenoxy)phenoxy]phenoxy]phenoxy]aniline
• CAS: 500577-28-6
• 化学式: C₃₀H₂₄N₂O₄
• 分子量: 476.532
• InChiKey: JVOQNVBQVMOFPV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.7
• 重原子数：
  36
• 可旋转键数：
  8
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  89
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• Novel aromatic diamine and polyimide thereof
  申请人：Mitsui Chemicals, Inc.

  公开号：US20030092870A1

  公开（公告）日：2003-05-15

  The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained. 1 In the formulas (1) and (4), n is an integer of 3 to 7, each R is independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group, the same or different two hetero atoms selected from nitrogen atoms and oxygen atoms bonded to each benzene ring are at the ortho- or meta-positions to each other on at least one benzene ring, and when n is 3, the hetero atoms are at the ortho- or meta-positions to each other on all the benzene rings. In the formula (4), Y is a tetravalent organic group.

  本发明的芳香族二胺化合物由以下式(1)表示，从该芳香族二胺化合物可以得到具有低温粘附性的重复单元由以下式(4)表示的聚酰亚胺。 在式(1)和式(4)中，n是3到7的整数，每个R独立地是氢原子、卤素原子和烃基所选的原子或基团，所选的两个异原子从氮原子和氧原子中选择，它们与至少一个苯环上的另一个异原子连接在邻位或间位上，当n为3时，异原子在所有苯环上都在邻位或间位上。在式(4)中，Y是四价有机基团。
• POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING POLYIMIDE RESIN COMPOSITION
  申请人：Iida Kenji

  公开号：US20130288120A1

  公开（公告）日：2013-10-31

  To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (α1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (β1) aromatic diamine represented by general formula (2), the diamine includes an (β2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (α1) tetracarboxylic acid dianhydride and the (β1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

  提供一种含有可溶于溶剂的聚酰亚胺的树脂组合物，能够在高温下提供高粘弹性和柔性的薄膜。为实现这一目标，提供了一种聚酰亚胺树脂组合物，其中包括具有四羧酸二酐和二胺的聚酰亚胺，其中所述的四羧酸二酐包括由通式（1）表示的（α1）四羧酸二酐，或所述的二胺包括由通式（2）表示的（β1）芳香族二胺，所述的二胺包括由通式（3）或（4）表示的（β2）脂肪族二胺，所述（α1）四羧酸二酐和（β1）芳香族二胺的总量相对于四羧酸二酐和二胺的总量为5至49摩尔％，聚酰亚胺的胺当量为4,000至20,000。
• Metal laminate
  申请人：Mitsui Chemicals, Inc.

  公开号：EP1420048A2

  公开（公告）日：2004-05-19

  A heat resistance resin composition having superb low-temperature adhesiveness and a polyimide/metal laminate which is superior in solder heat resistance and hardly generates swelling when forming a Au-Sn bond or Au-Au bond, which are used for lead-free soldering and COF packaging. A metal laminate comprising a layer comprises a resin composition prepared by compounding a bismaleimide compound represented bythefollowing formula (1) in a polyamic acid and/or a polyimide: wherein m denotes an integer of 0 or more, each X independently represent O, SO2, S, CO, CH2, C(CH3)2, C(CF3)2 or a direct bond and each R1 independently represents a hydrogen atom, a halogen atom or a hydrocarbon group and is independent of any other R1 as to the substitution position on the benzene ring; and a metal foil layer, wherein the layer of the resin composition is formed on at least one surface of the metal foil layer. A resin composition for a metal laminate.

  一种耐热性树脂组合物，具有极佳的低温粘合性，以及一种聚酰亚胺/金属层压板，在形成 Au-Sn 键或 Au-Au 键时，具有极佳的焊接耐热性且几乎不会产生膨胀，可用于无铅焊接和 COF 包装。一种金属层压板包括一层树脂组合物，该树脂组合物通过将下式 (1) 所代表的双马来酰亚胺化合物与聚酰胺和/或聚酰亚胺复合制备而成： 其中 m 表示 0 或 0 以上的整数，每个 X 独立地代表 O、SO2、S、CO、CH2、C(CH3)2、C(CF3)2 或直接键，每个 R1 独立地代表氢原子、卤素原子或烃基，且与苯环上的任何其他 R1 的取代位置无关；以及金属箔层，其中树脂组合物的层形成在金属箔层的至少一个表面上。一种用于金属层压板的树脂组合物。
• Polymide resin for electrical insulating material
  申请人：NITTO DENKO CORPORATION

  公开号：EP1494247A1

  公开（公告）日：2005-01-05

  The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.

  本发明提供了一种用于电绝缘材料的聚酰亚胺树脂，它包括一种具有通式 (I) 所代表的重复单元的聚酰亚胺树脂： 其中 R1 代表二价有机基团。
• ADHESIVE RESIN AND FILM ADHESIVES MADE BY USING THE SAME
  申请人：Mitsui Chemicals, Inc.

  公开号：EP1508584A1

  公开（公告）日：2005-02-23

  The adhesive resin of the invention comprises a polyimide resin obtained by reacting a diamine component containing the compound (1) as an essential component with a tetracarboxylic dianhydride component. The diamine component contains a silicone diamine having a specific structure and/or the tetracarboxylic dianhydride component contains a silicone acid dianhydride having a specific structure. Film adhesives made by using the adhesive resin preferably together with a thermosetting resin, and, if necessary, an inorganic filler are excellent in low-temperature adhesion, resistance to moisture absorption, heat resistance, and workability in adhesive adhering and are favorably usable as semiconductor-mounting materials for adhering semiconductor elements to substrates.

  本发明的粘合剂树脂包括一种聚酰亚胺树脂，它是由含有化合物(1)作为基本成分的二胺成分与四羧酸二酐成分反应而得。 二胺组分包含具有特定结构的硅酮二胺和/或四羧酸二酐组分包含具有特定结构的硅酮酸二酐。通过优选使用粘合剂树脂和热固性树脂以及必要时使用无机填料制成的薄膜粘合剂具有优异的低温粘合性、抗吸湿性、耐热性和粘合剂粘合的可加工性，可用作将半导体元件粘合到基板上的半导体安装材料。