Heat-Resistant Photosensitive Resin Composition, Method For Forming Pattern Using the Composition, and Electronic Part
申请人:Komatsu Hiroshi
公开号:US20080233513A1
公开(公告)日:2008-09-25
A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.