Problems: To provide an epoxy resin composition for prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, which does not generate toxic substance on combustion and excellent in ignition resistance, solder heat resistance after moisture absorption and high temperature rigidity, prepregs and multilayered printed wiring boards.
Means for solving problems: A phosphorous compound comprising 1.8 or more but less than 3 phenolic hydroxyl groups on an average and 0.8 or more phosphorous atom on an average within a molecule is reacted in advance with a particular bifunctional epoxy resin (selected from biphenyl, naphthalene, dicylcopentadiene or other types) in a ratio of epoxy equivalent to phenolic hydroxyl equivalent to be 1.2 or more but less than 3 to 1 to yield a preliminarily reacted epoxy resin, of which 20% by mass to 55% by mass against the whole epoxy resin composition is formulated together with a multifunctional epoxy resin having 2.8 or more epoxy groups on an average within a molecule, a curing agent comprising dicyandiamide and/or multifunctional phenolic compound and an inorganic filler with thermal decomposition temperature of 400°C or above, yielding an epoxy resin composition which is used to prepare prepregs used in manufacturing a printed wiring board.
问题提供一种用于制造印制电路板,特别是多层印制电路板的预浸料的环氧
树脂组合物,该组合物在燃烧时不会产生有毒物质,并且在耐燃性、吸湿后的焊接耐热性和高温刚性、预浸料和多层印制电路板方面具有优异的性能。
解决问题的方法:将分子中平均含有 1.8 个或 1.8 个以上但少于 3 个
酚羟基和 0.8 个或 0.8 个以上
磷原子的
磷化合物与特定的双官能环氧
树脂(选自
联苯、
萘、双
环戊二烯或其他类型)预先进行反应,环氧当量与
酚羟基当量之比为 1.2 或更多,但小于 3 比 1,以得到初步反应的环氧
树脂,其中占整个环氧
树脂组合物 20% 至 55% 质量的环氧
树脂组合物与分子内平均具有 2.8 或更多环氧基团的多功能环氧
树脂、由双
氰胺和/或多功能
酚类化合物组成的固化剂和热分解温度为 400°C 或以上的无机填料配制在一起,得到用于制备印刷线路板预浸料的环氧
树脂组合物。